Intel
®
Pentium
®
D Processor 800
Δ
Sequence
Datasheet
– On 90 nm Process in the 775-land LGA Package and supporting
Intel
®
Extended Memory 64 Technology
Φ
February 2006
Document Number: 307506-003
Contents
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APPLICATIONS.
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Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
D processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families. Over time processor numbers will increment based on changes in clock speed, cache, FSB, or other features, and
increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See
http://www.intel.com/products/processor_number
for details.
Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.
Performance will vary depending on your hardware and software configurations. See
http://www.intel.com/info/em64t
for more information including
details on which processors support EM64T or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
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subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2006 Intel Corporation.
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Δ
2
Datasheet
Contents
Contents
1
Introduction.................................................................................................................................... 11
1.1
1.2
2
2.1
2.2
Terminology ........................................................................................................................ 12
1.1.1 Processor Packaging Terminology ........................................................................ 12
References ......................................................................................................................... 13
Power and Ground Lands................................................................................................... 15
Decoupling Guidelines........................................................................................................ 15
2.2.1 VCC Decoupling .................................................................................................... 15
2.2.2 VTT Decoupling ..................................................................................................... 15
2.2.3 FSB Decoupling ..................................................................................................... 16
Voltage Identification .......................................................................................................... 16
Reserved, Unused, FC and TESTHI Signals...................................................................... 18
Voltage and Current Specifications .................................................................................... 19
2.5.1 Absolute Maximum and Minimum Ratings............................................................. 19
2.5.2 DC Voltage and Current Specifications .................................................................19
2.5.3 VCC Overshoot Specification ................................................................................ 25
2.5.4 Die Voltage Validation ........................................................................................... 26
Signaling Specifications...................................................................................................... 26
2.6.1 FSB Signal Groups ................................................................................................ 26
2.6.2 GTL+ Asynchronous Signals ................................................................................. 28
2.6.3 FSB DC Specifications .......................................................................................... 29
Clock Specifications............................................................................................................ 32
2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 32
2.7.2 FSB Frequency Select Signals .............................................................................. 32
2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 33
Package Mechanical Drawing ............................................................................................ 35
Processor Component Keep-Out Zones............................................................................. 39
Package Loading Specifications......................................................................................... 39
Package Handling Guidelines............................................................................................. 39
Package Insertion Specifications........................................................................................ 40
Processor Mass Specification............................................................................................. 40
Processor Materials ............................................................................................................ 40
Processor Markings ............................................................................................................ 40
Processor Land Coordinates ..............................................................................................42
Processor Land Assignments ............................................................................................. 43
Alphabetical Signals Reference .......................................................................................... 66
Processor Thermal Specifications ...................................................................................... 75
5.1.1 Thermal Specifications .......................................................................................... 75
5.1.2 Thermal Metrology ................................................................................................. 79
Electrical Specifications ................................................................................................................. 15
2.3
2.4
2.5
2.6
2.7
3
Package Mechanical Specifications ..............................................................................................35
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
Land Listing and Signal Descriptions ............................................................................................ 43
4.1
4.2
5
Thermal Specifications and Design Considerations ...................................................................... 75
5.1
Datasheet
3
Contents
5.2
Processor Thermal Features .............................................................................................. 79
5.2.1 Thermal Monitor..................................................................................................... 79
5.2.2 On-Demand Mode ................................................................................................. 80
5.2.3 PROCHOT# Signal................................................................................................ 80
5.2.4 FORCEPR# Signal Pin .......................................................................................... 81
5.2.5 THERMTRIP# Signal............................................................................................. 82
5.2.6 T
CONTROL
and Fan Speed Reduction.................................................................... 82
5.2.7 Thermal Diode ....................................................................................................... 82
Power-On Configuration Options........................................................................................ 85
Clock Control and Low Power States ................................................................................. 85
6.2.1 Normal State.......................................................................................................... 86
6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86
6.2.3 Stop-Grant State.................................................................................................... 87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88
6.2.5 Enhanced Intel SpeedStep
®
Technology .............................................................. 88
Mechanical Specifications .................................................................................................. 90
7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90
7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly....... 91
Electrical Requirements...................................................................................................... 91
7.2.1 Fan Heatsink Power Supply .................................................................................. 91
Thermal Specifications ....................................................................................................... 93
7.3.1 Boxed Processor Cooling Requirements............................................................... 93
7.3.2 Variable Speed Fan ............................................................................................... 95
Mechanical Specifications .................................................................................................. 98
8.1.1 Cooling Solution Dimensions................................................................................. 98
8.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 98
8.1.3 Boxed Processor Support and Retention Module (SRM) ...................................... 99
Electrical Requirements...................................................................................................... 99
8.2.1 Fan Heatsink Power Supply .................................................................................. 99
Thermal Specifications ..................................................................................................... 101
8.3.1 Boxed Processor Cooling Requirements............................................................. 101
8.3.2 Variable Speed Fan ............................................................................................. 102
Logic Analyzer Interface (LAI) .......................................................................................... 105
9.1.1 Mechanical Considerations.................................................................................. 105
9.1.2 Electrical Considerations ..................................................................................... 105
6
Features ........................................................................................................................................ 85
6.1
6.2
7
Boxed Processor Specifications .................................................................................................... 89
7.1
7.2
7.3
8
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications........................... 97
8.1
8.2
8.3
9
Debug Tools Specifications ......................................................................................................... 105
9.1
4
Datasheet
Contents
Figures
2-1
2-2
2-3
2-4
3-1
3-2
3-3
3-4
3-5
3-6
3-7
4-1
4-2
5-1
5-2
5-3
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
8-1
8-2
8-3
8-4
8-5
8-6
VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............ 22
VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............ 24
VCC Overshoot Example Waveform .......................................................................................... 25
Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34
Processor Package Assembly Sketch ........................................................................................ 35
Processor Package Drawing 1 ................................................................................................... 36
Processor Package Drawing 2 ................................................................................................... 37
Processor Package Drawing 3 ................................................................................................... 38
Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processors 840, 830, 820) ............. 40
Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processor 805)............................... 41
Processor Land Coordinates, Top View ..................................................................................... 42
Landout Diagram (Top View – Left Side).................................................................................... 44
Landout Diagram (Top View – Right Side) ................................................................................. 45
Thermal Profile for the Pentium D Processor with PRB=1 ......................................................... 77
Thermal Profile for the Pentium D Processor with PRB=0 ......................................................... 78
Case Temperature (TC) Measurement Location ........................................................................ 79
Processor Low Power State Machine......................................................................................... 86
Mechanical Representation of the Boxed Processor.................................................................. 89
Side View Space Requirements for the Boxed Processor (Applies to all four side views) ......... 90
Top View Space Requirements for the Boxed Processor........................................................... 90
Overall View Space Requirements for the Boxed Processor ..................................................... 91
Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................ 94
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................ 94
Boxed Processor Fan Heatsink Set Points................................................................................. 95
Mechanical Representation of the Boxed Processor.................................................................. 97
Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 98
Assembly Stack Including the Support and Retention Module ................................................... 99
Boxed Processor Fan Heatsink Power Cable Connector .........................................................100
Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101
Boxed Processor TMA Set Points ............................................................................................102
Datasheet
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