32KX8 FLASH 12V PROM, 100ns, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | QFJ |
| package instruction | PLASTIC, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 100 ns |
| Other features | BULK ERASE |
| command user interface | YES |
| Data polling | NO |
| Durability | 10000 Write/Erase Cycles |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.995 mm |
| memory density | 262144 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.56 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| type | NOR TYPE |
| width | 11.455 mm |
| Base Number Matches | 1 |
| M28F256-10XC1 | M39003/01-2696H/RR | M28F256-15B1 | M28F256-15B3 | M28F256-20C1 | M28F256-15C1 | M28F256-12C3 | M28F256-15B6 | M28F256-15C3 | M28F256-10XB1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | 32KX8 FLASH 12V PROM, 100ns, PQCC32, PLASTIC, LCC-32 | Tantalum Capacitor, Polarized, Tantalum (dry/solid), 100V, 10% +Tol, 10% -Tol, 0.33uF, | 32KX8 FLASH 12V PROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 32KX8 FLASH 12V PROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 32KX8 FLASH 12V PROM, 200ns, PQCC32, PLASTIC, LCC-32 | 32KX8 FLASH 12V PROM, 150ns, PQCC32, PLASTIC, LCC-32 | 32KX8 FLASH 12V PROM, 120ns, PQCC32, PLASTIC, LCC-32 | 32KX8 FLASH 12V PROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 32KX8 FLASH 12V PROM, 150ns, PQCC32, PLASTIC, LCC-32 | 32KX8 FLASH 12V PROM, 100ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | conform to | incompatible |
| package instruction | PLASTIC, LCC-32 | , | 0.600 INCH, PLASTIC, DIP-32 | 0.600 INCH, PLASTIC, DIP-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | 0.600 INCH, PLASTIC, DIP-32 | PLASTIC, LCC-32 | 0.600 INCH, PLASTIC, DIP-32 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e3 | e0 |
| length | 13.995 mm | 7.26 mm | 41.91 mm | 41.91 mm | 13.995 mm | 13.995 mm | 13.995 mm | 41.91 mm | 13.995 mm | 41.91 mm |
| Number of terminals | 32 | 2 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 85 °C | 125 °C | 70 °C |
| Package form | CHIP CARRIER | Axial | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| surface mount | YES | NO | NO | NO | YES | YES | YES | NO | YES | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| Maker | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | QFJ | - | DIP | DIP | QFJ | QFJ | QFJ | DIP | QFJ | DIP |
| Contacts | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Maximum access time | 100 ns | - | 150 ns | 150 ns | 200 ns | 150 ns | 120 ns | 150 ns | 150 ns | 100 ns |
| Other features | BULK ERASE | - | 1000 ERASE/PROGRAM CYCLES | 1000 ERASE/PROGRAM CYCLES | 1000 ERASE/PROGRAM CYCLES | 1000 ERASE/PROGRAM CYCLES | BULK ERASE | 1000 ERASE/PROGRAM CYCLES | 1000 ERASE/PROGRAM CYCLES | BULK ERASE |
| command user interface | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
| Data polling | NO | - | NO | NO | NO | NO | NO | NO | NO | NO |
| Durability | 10000 Write/Erase Cycles | - | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 code | R-PQCC-J32 | - | R-PDIP-T32 | R-PDIP-T32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T32 | R-PQCC-J32 | R-PDIP-T32 |
| memory density | 262144 bit | - | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| memory width | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| word count | 32768 words | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 32KX8 | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | - | DIP | DIP | QCCJ | QCCJ | QCCJ | DIP | QCCJ | DIP |
| Encapsulate equivalent code | LDCC32,.5X.6 | - | DIP32,.6 | DIP32,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP32,.6 | LDCC32,.5X.6 | DIP32,.6 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12 V | - | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.56 mm | - | 5.08 mm | 5.08 mm | 3.56 mm | 3.56 mm | 3.56 mm | 5.08 mm | 3.56 mm | 5.08 mm |
| Maximum standby current | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.03 mA | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.25 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | COMMERCIAL |
| Terminal form | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | - | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| switch bit | NO | - | NO | NO | NO | NO | NO | NO | NO | NO |
| type | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 11.455 mm | - | 15.24 mm | 15.24 mm | 11.455 mm | 11.455 mm | 11.455 mm | 15.24 mm | 11.455 mm | 15.24 mm |
| Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
京公网安备 11010802033920号
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