DM87S180J datasheet, PDF - EEWORLD Datasheet

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DM87S180J: DescriptionIC 1K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM; Categorystorage storage; File Size125KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM87S180J Overview

IC 1K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM

DM87S180J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	55 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX8
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum slew rate	0.17 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

DM87S180J Related Products

	DM87S180J	DM87S180N	DM87S180V	DM87S180VX	DM87S280J	DM77S280J	DM77S180J	DM87S280N
Description	IC 1K X 8 OTPROM, 55 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM	1KX8 OTPROM, 55ns, PDIP24, PLASTIC, DIP-24	1KX8 OTPROM, 55ns, PQCC28, PLASTIC, LCC-28	1KX8 OTPROM, 55ns, PQCC28, PLASTIC, LCC-28	1KX8 OTPROM, 55ns, CDIP24, CERAMIC, DIP-24	1KX8 OTPROM, 75ns, CDIP24, CERAMIC, DIP-24	1KX8 OTPROM, 75ns, CDIP24, CERAMIC, DIP-24	IC 1K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	QLCC	QLCC	DIP	DIP	DIP	DIP
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	QCCJ, LDCC28,.5SQ	QCCJ,	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.6	DIP, DIP24,.3
Contacts	24	24	28	28	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	75 ns	75 ns	55 ns
JESD-30 code	R-GDIP-T24	R-PDIP-T24	S-PQCC-J28	S-PQCC-J28	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-PDIP-T24
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	28	28	24	24	24	24
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	QCCJ	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	5.334 mm	4.57 mm	4.57 mm	5.715 mm	5.715 mm	4.572 mm	5.334 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	11.43 mm	11.43 mm	7.62 mm	7.62 mm	15.24 mm	15.24 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
JESD-609 code	e0	e0	e0	-	e0	e0	e0	e0
Encapsulate equivalent code	DIP24,.6	DIP24,.6	LDCC28,.5SQ	-	DIP24,.3	DIP24,.3	DIP24,.6	DIP24,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum slew rate	0.17 mA	0.17 mA	0.17 mA	-	0.17 mA	0.17 mA	0.17 mA	0.17 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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