DM87S190AJ/B+ datasheet, PDF - EEWORLD Datasheet

DM87S190AJ/B+: DescriptionIC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC; Categorystorage storage; File Size158KB，2 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM87S190AJ/B+ Overview

IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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