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DM87S190AJ

Description
IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size84KB,2 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric

DM87S190AJ Overview

IC,PROM,2KX8,TTL,DIP,24PIN,CERAMIC

DM87S190AJ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP24,.6
Reach Compliance Codecompliant
Is SamacsysN
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count2048 words
character code2000
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1
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