HN62W448NP-15 datasheet, PDF - EEWORLD Datasheet

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HN62W448NP-15: DescriptionMASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42; Categorystorage storage; File Size81KB，12 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN62W448NP-15 Overview

MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

HN62W448NP-15 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	DIP
package instruction	DIP, DIP42,.6
Contacts	42
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	150 ns
Other features	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 70NS
Spare memory width	8
JESD-30 code	R-PDIP-T42
JESD-609 code	e0
length	52.8 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	42
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP42,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	5.06 mm
Maximum standby current	0.00003 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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HN62W448N Series

524288-word

16-bit/1048576-word

8-bit CMOS Mask

Programmable ROM

ADE-203-484(A) (Z)

Preliminary

Rev. 0.1

Jun. 20, 1996

Description

The Hitachi HN62W448N is a 8-Mbit CMOS mask-programmable ROM organized either as 524288-words

by 16-bits or as 1048576-words by 8-bits. Realizing low power consumption with low voltage operation, this

memory is allowed for battery operation. And low voltage high speed page access of 60/70 ns and normal

access of 120/150 ns are realized.

Features

•

Low voltage operation : 3.3 V

0.3 V

•

Access time:



Normal access time: 120/150 ns (max)



Page access time: 60/70 ns (max)

•

Low power dissipation



Active: 220 mW (max)



Standby: 3

µW

(max)

•

Byte-wide or word-wide data organization (Switched by BHE terminal)

•

4-word page access mode

•

Three-state data output for wired or-tying

•

Directly LVTTL compatible (All inputs and outputs)

Preliminary: This document contains information an a new product. Specifications and information

contained herein are subject to change without notice.

HN62W448NP-15 Related Products

	HN62W448NP-15	HN62W448NFB-12	HN62W448NFB-15	HN62W448NTT-12	HN62W448NTT-15	HN62W448NP-12
Description	MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44	MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, SOP-44	MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, TSOP2-44	MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, TSOP2-44	MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	DIP	SOIC	SOIC	TSOP2	TSOP2	DIP
package instruction	DIP, DIP42,.6	SOP, SOP44,.63	SOP, SOP44,.63	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	DIP, DIP42,.6
Contacts	42	44	44	44	44	42
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	120 ns	150 ns	120 ns	150 ns	120 ns
Other features	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 70NS	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 60NS	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 70NS	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 60NS	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 70NS	USER CONFIGURABLE AS 512K X 16; PAGE ACCESS TIME = 60NS
Spare memory width	8	8	8	8	8	8
JESD-30 code	R-PDIP-T42	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDIP-T42
JESD-609 code	e0	e0	e0	e0	e0	e0
length	52.8 mm	28.5 mm	28.5 mm	18.41 mm	18.41 mm	52.8 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	42	44	44	44	44	42
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	TSOP2	TSOP2	DIP
Encapsulate equivalent code	DIP42,.6	SOP44,.63	SOP44,.63	TSOP44,.46,32	TSOP44,.46,32	DIP42,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.06 mm	3 mm	3 mm	1.2 mm	1.2 mm	5.06 mm
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	0.8 mm	0.8 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	12.6 mm	12.6 mm	10.16 mm	10.16 mm	15.24 mm
Is Samacsys	N	N	N	N	N	-
Base Number Matches	1	1	1	1	1	-

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