HN62W454TT-15 datasheet, PDF - EEWORLD Datasheet

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HN62W454TT-15: DescriptionMASK ROM, 256KX16, 150ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44; Categorystorage storage; File Size77KB，11 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN62W454TT-15 Overview

MASK ROM, 256KX16, 150ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44

HN62W454TT-15 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP44,.46,32
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	150 ns
Other features	USER CONFIGURABLE AS 256K X 16
Spare memory width	8
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	18.41 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00003 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
Base Number Matches	1

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HN62W454 Series

524288-word

8-bit/ 262144-word

16-bit CMOS

Mask Programmable ROM

ADE-203-403A (Z)

Rev. 1.0

May. 9, 1996

Description

The HN62W454 is a 4-Mbit CMOS mask-Programmable ROM organized either as 262144 words by 16 bits

or 524288 words by 8 bits. Realizing low power consumption, this memory is allowed for battery operation.

And a high speed access of 120 ns (max) is the most suitable to the system using a high speed micro-

computer by 16 bits.

Features

•

Low voltage operation



Operating supply voltage: 3.3 V

0.3 V

High speed



Access time: 120/150 ns (max)

Low power



Active: 216 mW (max)



Standby: 108

µW

(max)

Byte-wide or word-wide data organization (Switched by BHE terminal)

Three-state data output for or-tying

Directly LVTTL compatible



All inputs and outputs

•

Ordering Information

Type No.

HN62W454P-12

HN62W454P-15

HN62W454FA-12

HN62W454FA-15

HN62W454TT-12

HN62W454TT-15

Access time

120 ns

150 ns

120 ns

150 ns

120 ns

150 ns

Package

600 mil 40-pin plastic DIP (DP-40)

525 mil 40-pin plastic SOP (FP-40D)

400 mil 44-pin plastic TSOP II (TTP-44D)

HN62W454TT-15 Related Products

	HN62W454TT-15	HN62W454FA-12	HN62W454FA-15	HN62W454P-12	HN62W454P-15	HN62W454TT-12
Description	MASK ROM, 256KX16, 150ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 256KX16, 120ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	MASK ROM, 256KX16, 150ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40	MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 256KX16, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	MASK ROM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	TSOP2	SOIC	SOIC	DIP	DIP	TSOP2
package instruction	TSOP2, TSOP44,.46,32	SOP, SOP40,.56	SOP, SOP40,.56	DIP, DIP40,.6	DIP, DIP40,.6	TSOP2, TSOP44,.46,32
Contacts	44	40	40	40	40	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Is Samacsys	N	N	N	N	N	N
Maximum access time	150 ns	120 ns	150 ns	120 ns	150 ns	120 ns
Other features	USER CONFIGURABLE AS 256K X 16	USER CONFIGURABLE AS 256K X 16	USER CONFIGURABLE AS 256K X 16	USER CONFIGURABLE AS 256K X 16	USER CONFIGURABLE AS 256K X 16	USER CONFIGURABLE AS 256K X 16
Spare memory width	8	8	8	8	8	8
JESD-30 code	R-PDSO-G44	R-PDSO-G40	R-PDSO-G40	R-PDIP-T40	R-PDIP-T40	R-PDSO-G44
JESD-609 code	e0	e0	e0	e0	e0	e0
length	18.41 mm	26 mm	26 mm	52.8 mm	52.8 mm	18.41 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	44	40	40	40	40	44
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	SOP	SOP	DIP	DIP	TSOP2
Encapsulate equivalent code	TSOP44,.46,32	SOP40,.56	SOP40,.56	DIP40,.6	DIP40,.6	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	2.8 mm	2.8 mm	5.08 mm	5.08 mm	1.2 mm
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.05 mA	0.06 mA	0.05 mA	0.06 mA	0.05 mA	0.06 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	0.8 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	10.7 mm	10.7 mm	15.24 mm	15.24 mm	10.16 mm
Base Number Matches	1	1	1	1	1	1

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