IC,PROM,4KX8,TTL,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Maximum access time | 55 ns |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 32768 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 4096 words |
| character code | 4000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM87S421J | DM87S321J | DM77S321J | DM87S321N | DM87S421N | DM77S421J | |
|---|---|---|---|---|---|---|
| Description | IC,PROM,4KX8,TTL,DIP,24PIN,CERAMIC | IC,PROM,4KX8,TTL,DIP,24PIN,CERAMIC | IC,PROM,4KX8,TTL,DIP,24PIN,CERAMIC | IC,PROM,4KX8,TTL,DIP,24PIN,PLASTIC | IC,PROM,4KX8,TTL,DIP,24PIN,PLASTIC | IC,PROM,4KX8,TTL,DIP,24PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant | compliant |
| Maximum access time | 55 ns | 55 ns | 65 ns | 55 ns | 55 ns | 65 ns |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| organize | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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