Freescale Semiconductor
Technical Data
MPX53
Rev 4, 01/2007
50 kPa Uncompensated
Silicon Pressure Sensors
The MPX53/MPXV53GC series silicon piezoresistive pressure sensors
provide a very accurate and linear voltage output — directly proportional to the
applied pressure. These standard, low cost, uncompensated sensors permit
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge Design
• Ratiometric to Supply Voltage
• Easy to Use Chip Carrier Package Options
• 60 mV Span (Typ)
• Differential and Gauge Options
Typical Applications
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
ORDERING INFORMATION
Device
Type
Options
Case No.
MPX Series
Order No.
Packing
Options
Device
Marking
MPXV53G
MPXV53G
MPXV53G
MPX53D
MPX53DP
MPX53GP
MPX53
MPXV53GC
SERIES
UNCOMPENSATED PRESSURE
SENSOR
0 TO 50 kPA (0 – 7.25 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGES
MPXV53GC6U
CASE 482A-01
MPXV53GC7U
CASE 482C-03
SMALL OUTLINE PACKAGE
PIN NUMBERS
1
2
3
4
GND
(1)
+V
OUT
V
S
–V
OUT
5
6
7
8
N/C
N/C
N/C
N/C
SMALL OUTLINE PACKAGE
(1)
(MPXV53 SERIES)
Ported
Gauge, Side Port, SMT 482A
Elements
482A
482C
UNIBODY PACKAGE
Differential
Basic
Element
Differential
Ported
Elements Gauge
(2)
MPXV53GC6T1 Tape & Rail
MPXV53GC6U
MPXV53GC7U
MPX53D
MPX53DP
MPX53GP
Rails
Rails
—
—
—
(MPX53 SERIES)
344
344C
344B
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
1
2
GND
(1)
+V
OUT
3
4
V
S
–V
OUT
1. The MPXV53GC series pressure sensors are available with a pressure port, surface
mount, or DIP leadforms and two packing options.
2. MPX53 series pressure sensors are available in differential and gauge configurations.
Devices are available with basic element package or with pressure port fittings,
providing printed circuit board mounting ease and barbed hose pressure.
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX53D
CASE 344-15
MPX53GP
CASE 344B-01
MPX53DP
CASE 344C-01
© Freescale Semiconductor, Inc., 2007. All rights reserved.
+V
S
Sensor
+V
OUT
-V
OUT
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
proportional to the differential the pressure side (P1) relative
to the vacuum side (P2). Similarly, output voltage increases
as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1).
Figure 1
shows a schematic of the internal circuitry on the
stand-alone pressure sensor chip.
Table 1. Maximum Ratings
(1)
Rating
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
P
MAX
T
STG
T
A
Value
200
–40 to +125
–40 to +125
Unit
kPa
°C
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX53
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics
(V
S
= 3.0 Vdc, T
A
= 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range
(1)
Supply Voltage
(2)
Supply Current
Full Scale Span
(3)
Offset
(4)
Sensitivity
Linearity
(5)
Pressure Hysteresis
(5)
(0 to 50 kPa)
Temperature Hysteresis
(5)
(–40°C to +125°C)
Temperature Coefficient of Full Scale Span
(5)
Temperature Coefficient of Offset
(5)
Temperature Coefficient of Resistance
(5)
Input Impedance
Output Impedance
Response Time
(6)
(10% to 90%)
Warm-Up Time
Offset Stability
(7)
Symbol
P
OP
V
S
I
O
V
FSS
V
OFF
∆V/∆Ρ
—
—
—
TCV
FSS
TCV
OFF
TCR
Z
IN
Z
OUT
t
R
—
—
Min
0
—
—
45
0
—
–0.6
—
—
–0.22
—
0.31
355
750
—
—
—
Typ
—
3.0
6.0
60
20
1.2
—
±0.1
±0.5
—
±15
—
—
—
1.0
2.0
±0.5
Max
50
6.0
—
90
35
—
0.4
—
—
-0.16
—
0.37
505
1875
—
—
—
Units
kPa
V
DC
mAdc
mV
mV
mV/kPa
%V
FSS
%V
FSS
%V
FSS
%V
FSS
/°C
µV/°C
%Z
IN
/°C
Ω
Ω
ms
ms
%V
FSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (V
OFF
) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX53
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
Figure 2
shows the typical output characteristics of the
MPX53/MPXV53GC series over temperature.
The piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device
uses a unique transverse voltage diffused semiconductor
strain gauge which is sensitive to stresses produced in a thin
silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
100
90
80
70
Output (mVdc)
60
50
40
MPX53
V
S
= 3 Vdc
P1 > P2
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2053 series
sensors.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Freescale Application Note AN840.
+25°C
–40°C
Span
Range
(Typ)
30
20
10
0
PSI 0
kPa 0
+125×C
Offset
(Typ)
1
10
2
3
4
5
6
20
30
40
Pressure Differential
7
50
8
Figure 2. Output vs. Pressure Differential
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: V
out
= V
off
+ sensitivity x P over the operating
pressure range (see
Figure 3).
There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
90
80
70
60
50
Output (mVdc)
40
30
20
10
0
0
Pressure (kPA)
Offset
(V
OFF
)
MAX
P
OP
Theoretical
Actual
Span
(V
FSS
)
Linearity
Figure 3. Linearity Specification Comparison
MPX53
4
Sensors
Freescale Semiconductor
Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
P2
RTV Die
Bond
Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 4
illustrates the differential or gauge configuration
in the unibody chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX53/MPXV53GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX53D
MPX53DP
MPX53GP
MPX53GC Series
Case Type
344
344C
344B
482A, 482C
Pressure (P1) Side
Identifier
Stainless Steep Cap
Side with Port Marking
Side with Port Attached
Side with Port Attached
MPX53
Sensors
Freescale Semiconductor
5
Embedded System
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