HCTS240KMSR datasheet, PDF - EEWORLD Datasheet

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HCTS240KMSR: DescriptionIC,BUFFER/DRIVER,DUAL,4-BIT,CMOS, RAD HARD,FP,20PIN,CERAMIC; Categorylogic logic; File Size234KB，7 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HCTS240KMSR Overview

IC,BUFFER/DRIVER,DUAL,4-BIT,CMOS, RAD HARD,FP,20PIN,CERAMIC

HCTS240KMSR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DFP
Contacts	20
Reach Compliance Code	not_compliant
Is Samacsys	N
Control type	ENABLE LOW
JESD-30 code	R-XDFP-F20
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.006 A
Number of digits	4
Number of functions	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	INVERTED
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL20,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Prop。Delay @ Nom-Sup	20 ns
Certification status	Not Qualified
Filter level	38535V;38534K;883S
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
total dose	200k Rad(Si) V
Base Number Matches	1

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HCTS240KMSR Related Products

	HCTS240KMSR	HCTS240DMSR	HCTS240KMSH	HCTS240DMSH
Description	IC,BUFFER/DRIVER,DUAL,4-BIT,CMOS, RAD HARD,FP,20PIN,CERAMIC	HCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CDIP20, METAL SEALED, CERAMIC, DIP-20	IC,BUFFER/DRIVER,DUAL,4-BIT,CMOS, RAD HARD,FP,20PIN,CERAMIC	HCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CDIP20, METAL SEALED, CERAMIC, DIP-20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DFP	DIP	DFP	DIP
Contacts	20	20	20	20
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 code	R-XDFP-F20	R-XDIP-T20	R-XDFP-F20	R-XDIP-T20
JESD-609 code	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.006 A	0.006 A	0.005 A	0.005 A
Number of digits	4	4	4	4
Number of functions	2	2	2	2
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	INVERTED	INVERTED	INVERTED	INVERTED
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DFP	DIP
Encapsulate equivalent code	FL20,.3	DIP20,.3	FL20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	FLATPACK	IN-LINE
power supply	5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	20 ns	20 ns	25 ns	25 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535V;38534K;883S	38535V;38534K;883S	38535V;38534K;883S	38535V;38534K;883S
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
total dose	200k Rad(Si) V	200k Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	-	DIP, DIP20,.3	DFP, FL20,.3	DIP, DIP20,.3

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