Arithmetic Logic Unit, TTL, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| SN54S181JB | SN74S181NTB | SN74S181NB | SN74S181JB | |
|---|---|---|---|---|
| Description | Arithmetic Logic Unit, TTL, CDIP24 | Arithmetic Logic Unit, TTL, PDIP24 | Arithmetic Logic Unit, TTL, PDIP24 | Arithmetic Logic Unit, TTL, CDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
| Number of terminals | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - |
| package instruction | - | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |