L6116DME15 datasheet, PDF - EEWORLD Datasheet

L6116DME15: DescriptionStandard SRAM, 2KX8, 15ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24; Categorystorage storage; File Size767KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L6116DME15 Overview

Standard SRAM, 2KX8, 15ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Is Samacsys	N
Maximum access time	15 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-CDIP-T24
JESD-609 code	e0
length	30.48 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum seat height	4.953 mm
Maximum standby current	0.00015 A
Minimum standby current	2 V
Maximum slew rate	0.16 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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