EEWORLDEEWORLDEEWORLD

Part Number

Search

DP5Z2MW16PY3-20B

Description
Flash Module, 2MX16, 150ns, CQCC48, HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
Categorystorage    storage   
File Size4MB,21 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DP5Z2MW16PY3-20B Overview

Flash Module, 2MX16, 150ns, CQCC48, HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48

DP5Z2MW16PY3-20B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codeLCC
package instructionAQCCN, LCC48,.5X.87
Contacts48
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Is SamacsysN
Maximum access time150 ns
Other featuresHARDWARE DATA PROTECTION
Data pollingNO
JESD-30 codeR-CQCC-N48
length22.098 mm
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width16
Number of functions1
Number of departments/size32
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX16
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAQCCN
Encapsulate equivalent codeLCC48,.5X.87
Package shapeRECTANGULAR
Package formCHIP CARRIER, PIGGYBACK
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height4.3434 mm
Department size64K
Maximum standby current0.0004 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width12.7 mm
Base Number Matches1
2Mx16, 120 - 200ns, STACK/PGA
30A161-22
A
32 Megabit FLASH EEPROM
DP5Z2MW16Pn3
PRELIMINARY
DESCRIPTION:
The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory
subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC). Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate.
The Device packs 64-Megabits of FLASH EEPROM in an area as small as 0.463
in
2
, while maintaining a total height as low as 0.171 inches.
The DP5Z2MW16Pn3 contains two individual 1 Meg x 16 FLASH EEPROM
memory devices. Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
SLCC Stack
FEATURES:
Organization: 2Meg x 16
Fast Access Times: 120, 150, 200ns (max.)
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 64 K Word Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during Power Transitions
Packages Available:
DP5Z2MW16PY3 48 - Pin SLCC
DP5Z2MW16PI3
48 - Pin Straight Leaded SLCC
DP5Z2MW16PH3 48 - Pin Gullwing Leaded SLCC
DP5Z2MW16PJ3
48 - Pin ‘’J’’ Leaded SLCC
DP5Z2MW16PA3 50 - Pin PGA Dense-SLCC
Straight Leaded
Stack
‘’J’’ Leaded
Stack
Dense-Stack
Gullwing
Leaded Stack
30A161-22
REV. B
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1
TMS320C54xx DSP Practical Technology
I helped the teacher scan the book and share it with you...
鑫海宝贝 DSP and ARM Processors
BCD code representation method
[color=#000000]What is BCD? [/color] [color=#000000]It is a method of using binary numbers to represent decimal numbers. [/color] [color=#000000]There are two forms of BCD, pack BCD, unpack BCD [/colo...
kandy2059 MCU
The difference between internal tri-state and interface tri-state
Please help compare the following vaccination situations. Only the main code is written here: 1. Internal three-state (the three-state is output to the outside through the register) assign w_tri = w_t...
wanggq FPGA/CPLD
How to use SEGGER J-Trace Pro streaming mode to implement instruction tracing?
Intrusive and non-intrusive debuggingIn the process of developing embedded applications, debugging is needed to solve problems that arise during program operation. Depending on whether the "full-speed...
MamoYU Embedded System
Please help me figure out why this code fails.
I am a beginner and do not know EVC. I wrote a program to make a phone call, but for some reason, it works fine the first time I run it. The call goes through (it is a specific protocol, so it is diff...
randy06 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1783  2232  2576  1149  147  36  45  52  24  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号