DPS512X16MKI3-30C datasheet, PDF

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DPS512X16MKI3-30C: DescriptionSRAM Module, 1MX8, 30ns, CMOS, CQIP52, 0.145 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-52; Categorystorage storage; File Size702KB，8 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS512X16MKI3-30C Overview

SRAM Module, 1MX8, 30ns, CMOS, CQIP52, 0.145 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-52

DPS512X16MKI3-30C Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	QIP
package instruction	QIP,
Contacts	52
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Is Samacsys	N
Maximum access time	30 ns
JESD-30 code	R-CQIP-T52
length	24.892 mm
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	52
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.683 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	QUAD
width	14.224 mm
Base Number Matches	1

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8 Megabit High Speed CMOS SRAM

DPS512X16MKn3

DESCRIPTION:

The DPS512X16MKn3 High Speed SRAM ‘’STACK’’ modules are

a revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Available in straight leaded, ‘’J’’ leaded or gullwing leaded

packages. The module packs 8-Megabits of low-power CMOS

static RAM in an area as small as 0.549 in

, while maintaining a

total height as low as 0.145 inches.

The DPS512X16MKn3 STACK modules contain two individual

512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,

making the modules suitable for commercial, industrial and

military applications.

By using SLCCs, the ‘’Stack’’ family of modules offer a higher board

density of memory than available with conventional through-hole,

surface mount or hybrid techniques.

SLCC Stack

Straight

Leaded

Stack

FEATURES:

•

Organizations Available:

512K x 16 or 1 Meg x 8

•

Access Times: 20*, 25, 30, 35, 45ns

•

Fully Static Operation

- No clock or refresh required

•

Single +5V Power Supply,

10% Tolerance

•

TTL Compatible

•

Common Data Inputs and Outputs

•

Low Data Retention Voltage:

2.0V min.

•

Packages Available:

SLCC Stack

Straight Leaded Stack

‘’J’’ Leaded Stack

Gullwing Leaded Stack

Commercial and Industrial Grade only.

‘’J’’ Leaded

Stack

Gullwing

Leaded

Stack

FUNCTIONAL BLOCK DIAGRAM

A0 - A18

I/O0 - I/O15

CE0, CE1

OE0, OE1

N.C.

PIN NAMES

Address Inputs

Data Input/Output

Low Chip Enables

Write Enable

Output Enables

Power (+5V)

Ground

No Connect

30A129-02

REV. F

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

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