FIFO, 4KX9, 120ns, Asynchronous, CMOS, PQCC32,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | DALLAS |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Maximum access time | 120 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 7.14 MHz |
| period time | 140 ns |
| JESD-30 code | S-PQCC-J32 |
| JESD-609 code | e0 |
| memory density | 36864 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |

| DS2012R-120 | DS2012RN-50 | DS2012R-50 | DS2012R-65 | DS2012R-80 | |
|---|---|---|---|---|---|
| Description | FIFO, 4KX9, 120ns, Asynchronous, CMOS, PQCC32, | FIFO, 4KX9, 50ns, Asynchronous, CMOS, PQCC32, | FIFO, 4KX9, 50ns, Asynchronous, CMOS, PQCC32, | FIFO, 4KX9, 65ns, Asynchronous, CMOS, PQCC32, | FIFO, 4KX9, 80ns, Asynchronous, CMOS, PQCC32, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 120 ns | 50 ns | 50 ns | 65 ns | 80 ns |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| Maximum clock frequency (fCLK) | 7.14 MHz | 15.38 MHz | 15.38 MHz | 12.5 MHz | 10 MHz |
| JESD-30 code | S-PQCC-J32 | S-PQCC-J32 | S-PQCC-J32 | S-PQCC-J32 | S-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 | 4000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| organize | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maker | DALLAS | DALLAS | DALLAS | - | DALLAS |
| period time | 140 ns | - | 65 ns | 80 ns | 100 ns |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | - |