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DP5Z4MX16PY3-12M

Description
Flash Module, 4MX16, 120ns, CQCC48, HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
Categorystorage    storage   
File Size3MB,21 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DP5Z4MX16PY3-12M Overview

Flash Module, 4MX16, 120ns, CQCC48, HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48

DP5Z4MX16PY3-12M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codeLCC
package instructionAQCCN, LCC48,.5X.87
Contacts48
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Is SamacsysN
Maximum access time120 ns
Data pollingNO
JESD-30 codeR-CQCC-N48
length22.098 mm
memory density67108864 bit
Memory IC TypeFLASH MODULE
memory width16
Number of functions1
Number of departments/size64
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4MX16
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAQCCN
Encapsulate equivalent codeLCC48,.5X.87
Package shapeRECTANGULAR
Package formCHIP CARRIER, PIGGYBACK
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum seat height8.8646 mm
Department size64K
Maximum standby current0.0008 A
Maximum slew rate0.17 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width12.7 mm
Base Number Matches1
4Mx16, 120 - 200ns, STACK/PGA
30A161-04
B
64 Megabit FLASH EEPROM
DP5Z4MX16Pn3
PRELIMINARY
DESCRIPTION:
The DP5Z4MX16Pn3 ‘’SLCC’’ devices are a revolutionary new memory
subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC). Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate.
The Device packs 64-Megabits of FLASH EEPROM in an area as small as 0.463
in
2
, while maintaining a total height as low as 0.349 inches.
The DP5Z4MX16Pn3 contains four individual 2 Meg x 8 FLASH EEPROM
memory devices. Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
DP5Z4MX16PY3
DP5Z4MX16PI3
FEATURES:
Organization: 4Meg x 16
Fast Access Times: 120, 150, 200ns (max.)
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 128 Kbyte Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during Power Transitions
Packages Available:
DP5Z4MX16PY
48 - Pin SLCC
DP5Z4MX16PI3
48 - Pin Straight Leaded SLCC
DP5Z4MX16PH3
48 - Pin Gullwing Leaded SLCC
DP5Z4MX16PJ3
48 - Pin ‘’J’’ Leaded SLCC
DP5Z4MX16PA3
50 - Pin PGA Dense-SLCC
DP5Z4MX16PJ3
DP5Z4MX16PA3
DP5Z4MX16PH3
30A161-04
REV. B
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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