MPC8540PX667JC datasheet, PDF - EEWORLD Datasheet

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MPC8540PX667JC: Description32-BIT, 667MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，104 Pages; ManufacturerFREESCALE (NXP)

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MPC8540PX667JC Overview

32-BIT, 667MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

MPC8540PX667JC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	2142876364
Parts packaging code	BGA
package instruction	29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Contacts	783
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Address bus width	64
bit size	32
boundary scan	YES
maximum clock frequency	166 MHz
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B783
length	29 mm
low power mode	YES
Humidity sensitivity level	1
Number of terminals	783
Maximum operating temperature	105 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA783,28X28,40
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.2,2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	3.85 mm
speed	667 MHz
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Freescale Semiconductor

Technical Data

MPC8540EC

Rev. 4, 12/2006

MPC8540

Integrated Processor

Hardware Specifications

The MPC8540 integrates a PowerPC™ processor core built

on Power Architecture™ technology with system logic

required for networking, telecommunications, and wireless

infrastructure applications. The MPC8540 is a member of

the PowerQUICC™ III family of devices that combine

system-level support for industry-standard interfaces with

processors that implement the embedded category of the

Power Architecture technology. For functional

characteristics of the processor, refer to the

MPC8540

PowerQUICC™ III Integrated Host Processor Reference

Manual.

To locate any published errata or updates for this document,

contact your Freescale sales office.

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 15

DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Ethernet: Three-Speed,10/100, MII Management . . 22

Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 66

Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

System Design Information . . . . . . . . . . . . . . . . . . . 89

Document Revision History . . . . . . . . . . . . . . . . . . . 96

Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 101

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