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MPC106ARX66TG

Description
PCI Bridge/Memory Controller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size147KB,28 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC106ARX66TG Overview

PCI Bridge/Memory Controller

MPC106ARX66TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionBGA,
Reach Compliance Codeunknow
ECCN code3A001.A.3
Address bus width32
Bus compatibility60X; POWERPC 601; POWERPC 603; POWERPC 604
maximum clock frequency66 MHz
External data bus width64
JESD-30 codeR-CBGA-B304
length25 mm
Humidity sensitivity level1
Number of terminals304
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.16 mm
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width21 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Order Number: MPC106EC/D
Rev. 5, 8/2001
Semiconductor Products Sector
Technical Data
MPC106 PCI Bridge/Memory Controller
Hardware Specifications
The Motorola MPC106 PCI bridge/memory controller provides a PowerPC™ microprocessor common
hardware reference platform (CHRP™) compliant bridge between the PowerPC microprocessor family
and the Peripheral Component Interconnect (PCI) bus. In this document, the term ‘106’ is used as an
abbreviation for the phrase ‘MPC106 PCI bridge/memory controller.’ This document contains pertinent
physical characteristics of the 106. For functional characteristics, refer to the
MPC106 PCI
Bridge/Memory Controller User’s Manual
.
This document contains the following topics:
Topic
Page
Section 1.1, “Overview”
Section 1.2, “Features”
Section 1.3, “General Parameters”
Section 1.4, “Electrical and Thermal Characteristics”
Section 1.5, “Pin Assignments”
Section 1.6, “Pinout Listings
Section 1.7, “Package Description”
Section 1.8, “System Design Information”
Section 1.9, “Document Revision History”
Section 1.10, “Ordering Information”
2
3
5
5
15
16
20
22
27
27
This document contains information on a new product under development by Motorola.
Motorola reserves the right to change or discontinue this product without notice.
© Motorola, Inc., 2001. All rights reserved.
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