Crystal Connection or external frequency input.This pin has dual
functions. It can be connected to either an external crystal or an external
reference clock.
Ground Connection. Connect to system ground.
Spread range select. Digital logic input used to select frequency deviation
(Refer
to
Spread Deviation Selection Table).
This pin has an internal pull-
up resistor.
Spread spectrum clock output.
(Refer
to
Input Frequency and Modulation
Rate Table
and
Spread Deviation Selection Table)
Non-modulated Reference clock output of the input frequency.
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
Power Supply for the entire chip.
Crystal Connection. Input connection for an external crystal. If using an
external reference, this pin must be left unconnected.
1
2
3
4
5
6
7
8
XIN / CLKIN
VSS
SRS
ModOUT
REF
PD#
VDD
XOUT
I
P
I
O
O
I
P
O
Input Frequency and Modulation Rate
Part Number
ASM3P18S19B
Input Frequency Range
20MHz to 40MHz
Output Frequency range
20MHz to 40MHz
Modulation rate
Input Frequency / 512
Spread Deviation Selection
Part Number
ASM3P18S19B
1
-1.75% (DOWN)
SRS
0
Spread Deviation
-1.25% (DOWN)
Rev. 3 | Page 2 of 7 | www.onsemi.com
ASM3P18S19B
Absolute Maximum Ratings
Symbol
VDD, V
IN
T
STG
T
A
T
s
T
J
T
DV
Storage temperature
Operating temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage (As per JEDEC STD22- A114-B)
Parameter
Rating
-0.5 to +4.6
-65 to +125
0 to +70
260
150
2
Unit
V
°C
°C
°C
°C
KV
Voltage on any pin with respect to Ground
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated.)
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
CC
I
DD
VDD
t
ON
Z
OUT
Input Low voltage
Input High voltage
Parameter
Min
VSS - 0.3
2.0
-60.0
-
-
-
-
2.5
7.1
f
IN - min
-
-
-
-
Typ
-
-
-
-
3
3
-
-
-
4.5
3.3
0.18
50
Max
0.8
VDD + 0.3
-20.0
1.0
-
-
0.4
-
26.9
f
IN - max
-
-
-
-
Unit
V
V
µA
µA
mA
mA
V
V
mA
mA
V
mS
Ω
Input Low current (inputs PD#, SRS)
Input High current
X
OUT
Output low current @ 0.4V, VDD = 3.3V
X
OUT
Output high current @ 2.5V, VDD = 3.3V
Output Low voltage VDD = 3.3V, I
OL
= 20mA
Output High voltage VDD = 3.3V, I
OH
= 20mA
Dynamic supply current normal mode
3.3V and 25pF probe loading
Static supply current standby mode
Operating Voltage
Power up time (first locked clock cycle after power up)
Clock Output impedance
AC Electrical Characteristics
Symbol
Parameter
f
IN
f
OUT
t
LH
*
t
HL
*
t
JC
t
D
Input Frequency
Output Frequency
Output Rise time
Measured from 0.8V to 2.0V
Output Fall time
Measured from 0.8V to 2.0V
Jitter (Cycle to cycle)
Output Duty cycle
Min
20
20
-
-
-200
45
Typ
-
-
0.66
0.65
-
50
Max
40
40
-
-
200
55
Unit
MHz
MHz
nS
nS
pS
%
*t
LH
and t
HL
are measured into a capacitive load of 15pF
Rev. 3 | Page 3 of 7 | www.onsemi.com
ASM3P18S19B
Package Information
8-lead (150-mil) SOIC Package
Dimensions
Symbol
Min
A1
A
A2
B
C
D
E
e
H
L
θ
0.004
0.053
0.049
0.012
0.007
Inches
Max
0.010
0.069
0.059
0.020
0.010
Millimeters
Min
Max
0.10
1.35
1.25
0.31
0.18
4.90 BSC
3.91 BSC
1.27 BSC
6.00 BSC
0.41
0°
1.27
8°
0.25
1.75
1.50
0.51
0.25
0.193 BSC
0.154 BSC
0.050 BSC
0.236 BSC
0.016
0°
0.050
8°
Package length (Excluding end flash) D - 188 ~ 193 mils.
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