DSPIC33FJ32GP302T-H/MM datasheet, PDF

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DSPIC33FJ32GP302T-H/MM: Description16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC28, 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，436 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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DSPIC33FJ32GP302T-H/MM Overview

16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC28, 6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28

DSPIC33FJ32GP302T-H/MM Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFN
package instruction	6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	3A001.A.2.A
Is Samacsys	N
Has ADC	YES
Address bus width
bit size	16
maximum clock frequency	40 MHz
DAC channel	YES
DMA channel	YES
External data bus width
Format	FLOATING-POINT
JESD-30 code	S-PQCC-N28
JESD-609 code	e3
length	6 mm
Humidity sensitivity level	1
Number of I/O lines	21
Number of terminals	28
Maximum operating temperature	150 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC28,.24SQ,25
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
RAM (number of words)	2048
ROM programmability	FLASH
Maximum seat height	1 mm
speed	20 MHz
Maximum slew rate	45 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04, and

dsPIC33FJ128GPX02/X04

16-bit Digital Signal Controllers (up to 128 KB Flash and

16K SRAM) with Advanced Analog

Operating Conditions

• 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS

• 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS

System Peripherals

• 16-bit dual channel 100 ksps Audio DAC

• Cyclic Redundancy Check (CRC) module

• Up to five 16-bit and up to two 32-bit Timers/

Counters

• Up to four Input Capture (IC) modules

• Up to four Output Compare (OC) modules

• Real-Time Clock and Calendar (RTCC) module

Clock Management

•

2% internal oscillator

Programmable PLL and oscillator clock sources

Fail-Safe Clock Monitor (FSCM)

Independent Watchdog Timer

Low-power management modes

Fast wake-up and start-up

Communication Interfaces

• Parallel Master Port (PMP)

• Two UART modules (10 Mbps)

- Supports LIN 2.0 protocols

- RS-232, RS-485, and IrDA

support

• Two 4-wire SPI modules (15 Mbps)

• Enhanced CAN (ECAN) module (1 Mbaud) with

2.0B support

• I

C module (100K, 400K and 1Mbaud) with

SMbus support

• Data Converter Interface (DCI) module with I

codec support

Core Performance

• Up to 40 MIPS 16-bit dsPIC33F CPU

• Single-cycle MUL plus hardware divide

Advanced Analog Features

• 10/12-bit ADC with 1.1Msps/500 ksps rate:

- Up to 13 ADC input channels and four S&H

- Flexible/Independent trigger sources

• 150 ns Comparators:

- Up to two Analog Comparator modules

- 4-bit DAC with two ranges for Analog Comparators

Direct Memory Access (DMA)

• 8-channel DMA with no CPU stalls or overhead

• UART, SPI, ADC, ECAN, IC, OC, INT0

Input/Output

•

Software remappable pin functions

5V-tolerant pins

Selectable open drain and internal pull-ups

Up to 5 mA overvoltage clamp current/pin

Multiple external interrupts

Qualification and Class B Support

• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)

• Class B Safety Library, IEC 60730, VDE certified

Debugger Development Support

• In-circuit and in-application programming

• Two program breakpoints

• Trace and run-time watch

Packages

Type

SPDIP

SOIC

QFN-S

0.65

6x6x0.9

QFN

0.65

8x8x0.9

TQFP

0.80

10x10x1

Pin Count

I/O Pins

.100”

1.27

Contact Lead/Pitch

Dimensions

.285x.135x1.365”

7.50x2.05x17.9

Note:

All dimensions are in millimeters (mm) unless specified.

2007-2012 Microchip Technology Inc.

DS70292G-page 1

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