R4F2117BG20V datasheet, PDF - EEWORLD Datasheet

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R4F2117BG20V: Description16-BIT, FLASH, 20MHz, MICROCONTROLLER, PBGA176, 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-176; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，968 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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R4F2117BG20V Overview

16-BIT, FLASH, 20MHz, MICROCONTROLLER, PBGA176, 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-176

R4F2117BG20V Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	BGA
package instruction	13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-176
Contacts	176
Reach Compliance Code	compliant
Is Samacsys	N
Has ADC	YES
Address bus width
bit size	16
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B176
JESD-609 code	e6
length	13 mm
Humidity sensitivity level	3
Number of I/O lines	141
Number of terminals	176
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.4 mm
speed	20 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN BISMUTH
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	13 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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REJ09B0350-0200

The revision list can be viewed directly by

clicking the title page.

The revision list summarizes the locations of

revisions and additions. Details should always

be checked by referring to the relevant text.

H8S/2117

Group

Hardware Manual

Renesas 16-Bit Single-Chip Microcomputer

H8S Family / H8S/2100 Series

H8S/2117

R4F2117

All information contained in this material, including products and product

specifications at the time of publication of this material, is subject to change by

Renesas Technology Corp. without notice. Please review the latest information

published by Renesas Technology Corp. through various means, including the

Renesas Technology Corp. website (http://www.renesas.com).

Rev.2.00

Revision Date: Feb. 20, 2008

Notes regarding these materials

1. This document is provided for reference purposes only so that Renesas customers may select the appropriate

Renesas products for their use. Renesas neither makes warranties or representations with respect to the

accuracy or completeness of the information contained in this document nor grants any license to any

intellectual property rights or any other rights of Renesas or any third party with respect to the information in

this document.

2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising

out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,

programs, algorithms, and application circuit examples.

3. You should not use the products or the technology described in this document for the purpose of military

applications such as the development of weapons of mass destruction or for the purpose of any other military

use. When exporting the products or technology described herein, you should follow the applicable export

control laws and regulations, and procedures required by such laws and regulations.

4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and

application circuit examples, is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas products listed in this

document, please confirm the latest product information with a Renesas sales office. Also, please pay regular

and careful attention to additional and different information to be disclosed by Renesas such as that disclosed

through our website. (http://www.renesas.com )

5. Renesas has used reasonable care in compiling the information included in this document, but Renesas

assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information

included in this document.

6. When using or otherwise relying on the information in this document, you should evaluate the information in

light of the total system before deciding about the applicability of such information to the intended application.

Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any

particular application and specifically disclaims any liability arising out of the application and use of the

information in this document or Renesas products.

7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas

products are not designed, manufactured or tested for applications or otherwise in systems the failure or

malfunction of which may cause a direct threat to human life or create a risk of human injury or which require

especially high quality and reliability such as safety systems, or equipment or systems for transportation and

traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication

transmission. If you are considering the use of our products for such purposes, please contact a Renesas

sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.

8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:

(1) artificial life support devices or systems

(2) surgical implantations

(3) healthcare intervention (e.g., excision, administration of medication, etc.)

(4) any other purposes that pose a direct threat to human life

Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who

elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas

Technology Corp., its affiliated companies and their officers, directors, and employees against any and all

damages arising out of such applications.

9. You should use the products described herein within the range specified by Renesas, especially with respect

to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or

damages arising out of the use of Renesas products beyond such specified ranges.

10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific

characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use

conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and

injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for

hardware and software including but not limited to redundancy, fire control and malfunction prevention,

appropriate treatment for aging degradation or any other applicable measures. Among others, since the

evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or

system manufactured by you.

11. In case Renesas products listed in this document are detached from the products to which the Renesas

products are attached or affixed, the risk of accident such as swallowing by infants and small children is very

high. You should implement safety measures so that Renesas products may not be easily detached from your

products. Renesas shall have no liability for damages arising out of such detachment.

12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written

approval from Renesas.

13. Please contact a Renesas sales office if you have any questions regarding the information contained in this

document, Renesas semiconductor products, or if you have any other inquiries.

Rev. 2.00 Feb. 20, 2008 Page iii of xxiv

General Precautions in the Handling of MPU/MCU Products

The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes

on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under

General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each

other, the description in the body of the manual takes precedence.

1. Handling of Unused Pins

Handle unused pins in accord with the directions given under Handling of Unused Pins in the

manual.



The input pins of CMOS products are generally in the high-impedance state. In operation

with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the

vicinity of LSI, an associated shoot-through current flows internally, and malfunctions may

occur due to the false recognition of the pin state as an input signal. Unused pins should

be handled as described under Handling of Unused Pins in the manual.

2. Processing at Power-on

The state of the product is undefined at the moment when power is supplied.



The states of internal circuits in the LSI are indeterminate and the states of register

settings and pins are undefined at the moment when power is supplied.

In a finished product where the reset signal is applied to the external reset pin, the states

of pins are not guaranteed from the moment when power is supplied until the reset

process is completed.

In a similar way, the states of pins in a product that is reset by an on-chip power-on reset

function are not guaranteed from the moment when power is supplied until the power

reaches the level at which resetting has been specified.

3. Prohibition of Access to Reserved Addresses

Access to reserved addresses is prohibited.



The reserved addresses are provided for the possible future expansion of functions. Do

not access these addresses; the correct operation of LSI is not guaranteed if they are

accessed.

4. Clock Signals

After applying a reset, only release the reset line after the operating clock signal has become

stable. When switching the clock signal during program execution, wait until the target clock

signal has stabilized.



When the clock signal is generated with an external resonator (or from an external

oscillator) during a reset, ensure that the reset line is only released after full stabilization of

the clock signal. Moreover, when switching to a clock signal produced with an external

resonator (or by an external oscillator) while program execution is in progress, wait until

the target clock signal is stable.

5. Differences between Products

Before changing from one product to another, i.e. to one with a different part number, confirm

that the change will not lead to problems.



The characteristics of MPU/MCU in the same group but having different part numbers may

differ because of the differences in internal memory capacity and layout pattern. When

changing to products of different part numbers, implement a system-evaluation test for

each of the products.

Rev. 2.00 Feb. 20, 2008 Page iv of xxiv

R4F2117BG20V Related Products

	R4F2117BG20V	R4F2117TE20V	R4F2117LP20V
Description	16-BIT, FLASH, 20MHz, MICROCONTROLLER, PBGA176, 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-176	16-BIT, FLASH, 20MHz, MICROCONTROLLER, PQFP144, 16 X 16 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, QFP-144	16-BIT, FLASH, 20MHz, MICROCONTROLLER, PBGA145, 9 X 9 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TLP-145
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	BGA	QFP	BGA
package instruction	13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-176	16 X 16 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, QFP-144	TFBGA,
Contacts	176	144	145
Reach Compliance Code	compliant	compliant	compliant
Has ADC	YES	YES	YES
bit size	16	16	16
maximum clock frequency	20 MHz	20 MHz	20 MHz
DAC channel	NO	NO	NO
DMA channel	YES	YES	YES
JESD-30 code	S-PBGA-B176	S-PQFP-G144	S-PBGA-B145
length	13 mm	16 mm	9 mm
Number of I/O lines	141	125	126
Number of terminals	176	144	145
Maximum operating temperature	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
PWM channel	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	TFQFP	TFBGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	1.4 mm	1.2 mm	1.2 mm
speed	20 MHz	20 MHz	20 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal form	BALL	GULL WING	BALL
Terminal pitch	0.8 mm	0.4 mm	0.65 mm
Terminal location	BOTTOM	QUAD	BOTTOM
width	13 mm	16 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Is it lead-free?	Lead free	Lead free	-
Is it Rohs certified?	conform to	conform to	-
JESD-609 code	e6	e6	-
Humidity sensitivity level	3	3	-
Peak Reflow Temperature (Celsius)	260	260	-
Terminal surface	TIN BISMUTH	TIN BISMUTH	-
Maximum time at peak reflow temperature	20	20	-

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