NT
Features
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Applications
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Fast tripping resettable circuit protection
Surface mount packaging for automated
assembly
Small footprint size (1210)
RoHS compliant*
Agency recognition*:
T V Rheinland
Game consoles
PC motherboards
USB current-limiting compliance
IEEE 1394 ports
Mobile phones
Digital cameras
*R
oH
S
CO
M
PL
IA
MF-USMF Series -
PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23
°C
RMin.
R1Max.
Max. Time
To Trip
Amperes
at 23
°C
Seconds
at 23
°C
Amperes
at 23
°C
Hold
Trip
Watts
at 23
°C
Typ.
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150*
*UL approval pending.
30
30
30
6
13.2
6
6
6
10
10
10
40
40
40
40
40
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
0.15
0.30
0.40
0.75
1.00
1.50
2.20
3.00
2.800
0.800
0.400
0.200
0.180
0.070
0.050
0.030
50.000
15.000
5.000
1.300
0.900
0.450
0.210
0.110
0.25
0.50
8.00
8.00
8.00
8.00
5.00
5.00
1.50
0.60
0.02
0.20
0.10
0.10
1.00
5.00
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-USMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin
≤
R
≤
R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T
≤
max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ..............................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number ....................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Thermal Derating Chart - Ihold (Amps)
Ambient Operating Temperature
Model
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
-40
°C
0.08
0.15
0.32
0.51
0.76
1.10
1.60
2.30
-20
°C
0.07
0.13
0.28
0.46
0.66
0.97
1.42
2.02
0
°C
0.06
0.12
0.24
0.40
0.58
0.86
1.26
1.76
23
°C
0.05
0.10
0.20
0.34
0.48
0.72
1.10
1.43
40
°C
0.04
0.09
0.18
0.30
0.42
0.64
0.94
1.24
50
°C
0.04
0.08
0.16
0.27
0.38
0.58
0.86
1.11
60
°C
0.03
0.07
0.14
0.24
0.35
0.55
0.80
1.00
70
°C
0.03
0.06
0.12
0.22
0.29
0.47
0.70
0.85
85
°C
0.02
0.05
0.10
0.18
0.23
0.39
0.58
0.65
*
RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-USMF Series -
PTC Resettable Fuses
Product Dimensions
Model
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
Packaging: 3000 pcs. per reel.
A
Min.
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
Max.
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
Min.
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
B
Max.
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
Min.
0.80
(0.031)
0.80
(0.031)
0.80
(0.031)
0.55
(0.022)
0.55
(0.022)
0.55
(0.022)
0.55
(0.022)
0.40
(0.016)
C
Max.
1.1
(0.043)
1.1
(0.043)
1.1
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT =
MM
(INCHES)
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
B
D
Solder Reflow Recommendations
Preheating
Soldering
Cooling
300
250
Temperature (°C)
200
150
100
50
0
Notes:
• MF-USMF models cannot be wave soldered.
• If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
160–220
10–20
Time (seconds)
120
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-USMF Series -
PTC Resettable Fuses
Typical Time to Trip at 23
°
C
100
MF-USMF075
MF-USMF110
MF-USMF035 MF-USMF050
MF-USMF150
How to Order
MF - USMF 010 - 2
Multifuse
®
Product
Designator
Series
USMF = 1210 Surface Mount
Component
Hold Current, Ihold
005-150 (0.05-1.50 Amps)
MF-USMF010
10
Time to Trip (Seconds)
1
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
MF-USMF005
0.1
Typical Part Marking
Represents total content. Layout may vary.
0.01
0.001
0.1
1
10
100
Fault Current (Amps)
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specific customer applications may differ from these values due
to the influence of other variables.
6
A
PART IDENTIFICATION:
MF-USMF005 = 0
MF-USMF010 = 1
MF-USMF020 = 2
MF-USMF035 = 3
MF-USMF050 = 4
MF-USMF075 = 5
MF-USMF110 = 6
MF-USMF150 = 8
BIWEEKLY DATE CODE:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
Circuit Protection Division
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
MF-USMF SERIES, REV. C, 01/06
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-USMF Series Tape and Reel Specifications
MF-USMF Series
per EIA 481-2
8.0 ± 0.3
(0.315 ± 0.012)
4.0 ± 0.1
(0.157 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
2.76 ± 0.10
(0.109 ± 0.004)
3.50 ± 0.10
(0.138 ± 0.004)
4.35
(0.171)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
6.25
(0.246)
0.6
(0.024)
0.1
(0.004)
1.07 ± 0.10
(0.042 ± 0.004)
390
(15.35)
160
(6.30)
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
MM
(INCHES)
185
(7.283)
50
(1.97)
8.4 + 1.5/ -0.0
(0.331 + 0.059/-0.0)
14.4
(0.567)
P0
T
D0
P2
E1
UNIT =
W2(MEASURED
AT HUB)
COVER
TAPE
F
B1
B0
K0
T1
P1
A0
W1(MEASURED
AT HUB)
E2 W
A
N(HUB DIA.)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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