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DPS1MX16MKY3-30I

Description
SRAM Module, 1MX16, 30ns, CMOS, LEADLESS, SLCC-52
Categorystorage    storage   
File Size714KB,8 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS1MX16MKY3-30I Overview

SRAM Module, 1MX16, 30ns, CMOS, LEADLESS, SLCC-52

DPS1MX16MKY3-30I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQMA
package instructionQCCN, LCC52,.55X.97
Contacts52
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Is SamacsysN
Maximum access time30 ns
Spare memory width8
I/O typeCOMMON
JESD-30 codeR-XQMA-N52
JESD-609 codee0
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width16
Number of functions1
Number of ports1
Number of terminals52
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX16
Output characteristics3-STATE
ExportableYES
Package body materialUNSPECIFIED
encapsulated codeQCCN
Encapsulate equivalent codeLCC52,.55X.97
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0032 A
Minimum standby current2 V
Maximum slew rate0.48 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1
16 Megabit High Speed CMOS SRAM
DPS1MX16MKn3
SLCC Stack
DESCRIPTION:
The DPS1MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.269 inches.
The DPS1MX16MKn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and
military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
Straight
Leaded
Stack
FEATURES:
Organizations Available:
1Meg x 16 or 2 Meg x 8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
‘’J’’ Leaded
Stack
Gullwing
Leaded
Stack
*
Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
I/O0 - I/O15
CE0 - CE3
WE
OE0, OE1
V
DD
V
SS
N.C.
30A129-04
REV. E
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
Address Inputs
Data Input/Output
Low Chip Enables
Write Enable
Output Enables
Power (+5V)
Ground
No Connect
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