DPS256P4-25C datasheet, PDF - EEWORLD Datasheet

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DPS256P4-25C: DescriptionSRAM Module, 256KX4, 25ns, CMOS; Categorystorage storage; File Size164KB，6 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS256P4-25C Overview

SRAM Module, 256KX4, 25ns, CMOS

DPS256P4-25C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	, SIP30,.2
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	25 ns
I/O type	SEPARATE
JESD-30 code	R-XSMA-T30
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	SRAM MODULE
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	30
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX4
Output characteristics	3-STATE
Exportable	NO
Package body material	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.00004 A
Minimum standby current	4.5 V
Maximum slew rate	0.56 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	SINGLE
Base Number Matches	1

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DPS256P4-25C Related Products

	DPS256P4-25C	DPS256P4-35C	DPS256P4-45C	DPS256P4-55C
Description	SRAM Module, 256KX4, 25ns, CMOS	SRAM Module, 256KX4, 35ns, CMOS	SRAM Module, 256KX4, 45ns, CMOS	SRAM Module, 256KX4, 55ns, CMOS
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	, SIP30,.2	, SIP30,.2	, SIP30,.2	, SIP30,.2
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Is Samacsys	N	N	N	N
Maximum access time	25 ns	35 ns	45 ns	55 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-XSMA-T30	R-XSMA-T30	R-XSMA-T30	R-XSMA-T30
JESD-609 code	e0	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	4	4	4	4
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	30	30	30	30
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX4	256KX4	256KX4	256KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2	SIP30,.2	SIP30,.2	SIP30,.2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00004 A	0.00004 A	0.00004 A	0.00004 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.56 mA	0.56 mA	0.56 mA	0.56 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE
Base Number Matches	1	1	1	1

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