DISCRETE SEMICONDUCTORS
DATA SHEET
1/3 page (Datasheet)
M3D054
BZV80; BZV81
Voltage reference diodes
Product specification
Supersedes data of April 1992
1996 Mar 21
Philips Semiconductors
Product specification
Voltage reference diodes
FEATURES
•
Reference voltage range:
5.89 to 6.51 V (nom. 6.20 V)
•
Low temperature coefficient range:
max. 0.005 to 0.01 %/K.
handbook, 4 columns
BZV80; BZV81
DESCRIPTION
Leadless voltage reference diode in a small glass SOD80 SMD package.
k
a
APPLICATION
•
Voltage reference sources.
MAM215
Fig.1 Simplified outline (SOD80) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
I
Z
P
tot
T
stg
T
j
T
amb
Note
1. Device mounted on a FR4 printed-circuit board.
PARAMETER
working current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
T
amb
= 50
°C;
note 1
CONDITIONS
MIN.
−
−
−65
−
−20
MAX.
50
400
+200
200
+80
UNIT
mA
mW
°C
°C
°C
1996 Mar 21
2
Philips Semiconductors
Product specification
Voltage reference diodes
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
ref
∆V
ref
PARAMETER
reference voltage
reference voltage excursion
BZV80
BZV81
S
Z
temperature coefficient
BZV80
BZV81
r
dif
Notes
differential resistance
I
Z
= 7.5 mA
CONDITIONS
I
Z
= 7.5 mA
I
Z
= 7.5 mA; test points for
T
amb
:
−20;
+25; +55; +80
°C;
notes 1 and 2
I
Z
= 7.5 mA: notes 1 and 2
−
−
−
−
−
MIN.
5.89
−
−
BZV80; BZV81
NOM.
6.20
−
−
MAX.
6.51
62
31
0.01
0.005
15
V
UNIT
mV
mV
%/K
%/K
Ω
1. The quoted values of
∆V
ref
are based on a constant current I
Z
. Two factors can cause
∆V
ref
to change with I
Z
, namely
the differential resistance r
dif
and the temperature coefficient S
Z
.
a) Each change of I
Z
can result in a maximum change of
∆V
ref
as follows:
∆V
ref
(mV) =
∆I
Z
(mA)
×
15
Ω
taking into account that r
dif
is max. 15
Ω.
b) The temperature coefficient of the reference voltage S
Z
is also a function of I
Z
. However, for these reference
diodes S
Z
varies max.
±0.05
mV/K or
±0.001%/K
when I
Z
is between 6 and 10 mA, so this effect can be neglected
in practice for these types.
2. The temperature coefficient of the reference voltage is obtained from the following formula:
V
ref1
–
V
ref2
100
S
Z
=
-------------------------------------
×
------------------- %/K
-
-
T
amb2
–
T
amb1
V
ref nom
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on a FR4 printed-circuit board.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
300
380
UNIT
K/W
K/W
1996 Mar 21
3
Philips Semiconductors
Product specification
Voltage reference diodes
PACKAGE OUTLINE
BZV80; BZV81
handbook, full pagewidth
1.7
O 1.5
0.3
3.7
3.3
Dimensions in mm.
The cathode is indicated by a yellow band.
0.3
MBA388 - 2
Fig.2 SOD80.
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
1996 Mar 21
4
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