EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
orDer inForMaTion
LEAD FREE FINISH
LTC3872ETS8-1#PBF
LTC3872ITS8-1#PBF
LTC3872HTS8-1#PBF
LTC3872EDDB-1#PBF
LTC3872IDDB-1#PBF
LTC3872HDDB-1#PBF
TAPE AND REEL
LTC3872ETS8-1#TRPBF
LTC3872ITS8-1#TRPBF
LTC3872HTS8-1#TRPBF
LTC3872EDDB-1#TRPBF
LTC3872IDDB-1#TRPBF
LTC3872HDDB-1#TRPBF
PART MARKING*
LTCFN
LTCFN
LTCFN
LCFK
LCFK
LCFK
PACKAGE DESCRIPTION
8-Lead Plastic TSOT-23
8-Lead Plastic TSOT-23
8-Lead Plastic TSOT-23
8-Lead (3mm
×
2mm) Plastic DFN
8-Lead (3mm
×
2mm) Plastic DFN
8-Lead (3mm
×
2mm) Plastic DFN
TEMPERATURE RANGE
–40°C to 85°C
–40°C to 125°C
–40°C to 150°C
–40°C to 85°C
–40°C to 125°C
–40°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
38721f
2
For more information
www.linear.com/LTC3872-1
LTC3872-1
elecTrical characTerisTics
PARAMETER
Input Voltage Range
Input DC Supply Current
Normal Operation
Shutdown
UVLO
Undervoltage Lockout Threshold
Shutdown Threshold (at RUN/SS)
Regulated Feedback Voltage
Feedback Voltage Line Regulation
Feedback Voltage Load Regulation
V
FB
Input Current
RUN/SS Pull Up Current
Oscillator Frequency
Normal Operation
Gate Drive Rise Time
Gate Drive Fall Time
Peak Current Sense Voltage
Typicals at V
IN
= 4.2V (Note 4)
2.75V ≤ V
IN
≤ 9.8V
V
RUN/SS
= 0V
V
IN
< UVLO Threshold
V
IN
Rising
V
IN
Falling
V
RUN/SS
Falling
V
RUN/SS
Rising
(Note 5) LTC3872-1E
LTC3872-1I and LTC3872-1H
2.75V < V
IN
< 9V (Note 5)
V
ITH
= 1.6V (Note 5)
V
ITH
= 1V (Note 5)
(Note 5)
V
RUN/SS
= 0
V
FB
= 1V
C
LOAD
= 3000pF
C
LOAD
= 3000pF
IPRG = GND (Note 6)
LTC3872-1E
LTC3872-1I
LTC3872-1H
LTC3872-1E
LTC3872-1I
LTC3872-1H
LTC3872-1E
LTC3872-1I
LTC3872-1H
l
l
l
l
l
l
l
l
l
l
l
l
l
l
l
The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
= 25°C (Note 2). V
IN
= 4.2V unless otherwise noted.
CONDITIONS
l
MIN
2.75
TYP
MAX
9.8
UNITS
V
µA
µA
µA
V
V
V
V
V
V
mV/V
%
%
250
8
20
2.3
2.05
0.6
0.65
1.182
1.178
2.45
2.3
0.85
0.95
1.2
1.2
0.14
0.05
–0.05
25
0.35
500
0.7
550
40
40
90
85
80
160
150
145
260
250
240
105
105
105
180
180
180
285
285
285
1
400
20
35
2.75
2.55
1.05
1.15
1.218
1.218
50
1.25
650
nA
µA
kHz
ns
ns
120
120
120
200
200
200
310
310
310
mV
mV
mV
mV
mV
mV
mV
mV
mV
ms
IPRG = Float
IPRG = V
IN
Default Internal Soft-Start Time
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC3872-1 is tested under pulsed load conditions such that
T
J
≈ T
A
. The LTC3872-1E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
junction temperature range are assured by design, characterization and
correlation with statistical process controls. The LTC3872-1I is guaranteed
over the –40°C to 125°C operating junction temperature range. The
LTC3872-1H is guaranteed over the full –40°C to 150°C operating junction
temperature range. The maximum ambient temperature consistent with
these specifications is determined by specific operating conditions in
conjunction with board layout, the rated package thermal impedance and
other environmental factors.
Note 3:
T
J
is calculated from the ambient temperature T
A
and power
dissipation P
D
according to the following formula:
LTC3872-1TS8: T
J
= T
A
+ (P
D
• 195°C/W)
LTC3872-1DDB: T
J
= T
A
+ (P
D
• 76°C/W)
Note 4:
The dynamic input supply current is higher due to power MOSFET
gate charging (Q
G
• f
OSC
). See Applications Information.
Note 5:
The LTC3872-1 is tested in a feedback loop which servos V
FB
to
the reference voltage with the I
TH
pin forced to the midpoint of its voltage
range (0.7V ≤ V
ITH
≤ 1.9V, midpoint = 1.3V).
Note 6:
Rise and fall times are measured at 10% and 90% levels.
Voice technology is widely used in smart medical care, smart agriculture and other fields. In recent years, the application of voice technology in wearables has also become popular. Not long ago, the ...
This example is very simple, just configure SDRAM, then directly use pointer to access, write data, read data, and turn on the LED if it is OK. But what confuses me most is that I can't find the initi...
I am a beginner, and now I am learning about Linux kernel modules. This is a simple makefile for the hello kernel module. How should I write this KERNELDIR path? Should I write the kernel path on the ...
Requires more than 6 serial ports, 2 CAN interfaces, with optical isolation and power isolation, 800*600 CRT interface output, SDRAM or DDR DRAM capacity greater than 64MB, 12V power input...
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
New energy pure electric vehicles generally accelerate faster than comparable fuel-powered vehicles, both from a standing start and while accelerating. Many believe this is simply due to the motor'...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[Details]
Electric vehicles are becoming increasingly popular, with increasingly longer ranges. There are two ways to charge electric vehicles: slow charging and fast charging. Which is the most suitable? Sl...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
Inverter power supplies on the market can generally be divided into two categories: sine wave inverters and square wave inverters. Some engineers also like to categorize pure sine wave inverters as...[Details]
Consumer demand for premium listening experiences has driven rapid evolution in the wireless headphone market in recent years. Hybrid designs, which utilize two drivers per earbud to enhance sound ...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
In camera and display systems, the demand for high-performance and low-power data interfaces is driving continuous technological evolution. The evolution of MIPI D-PHY and MIPI C-PHY clearly ...[Details]
0 Introduction
With a rapidly aging population, a young couple is now required to care for an increasing number of elderly people, leading to a growing difficulty in providing care for them. E...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
We know that the power output by the engine does not directly act on the wheels to drive the car, but needs to pass through a series of power transmission mechanisms. So how is the power transmitte...[Details]
Electronics engineers all know that transient voltage suppression (TVS) diodes are used to protect ports, preventing damage to downstream circuits caused by transient voltage surges. In short, TVS ...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
