IDM29811JM/883C datasheet, PDF

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IDM29811JM/883C: DescriptionIC,SEQUENTIAL ADDRESS GENERATOR,S-TTL,DIP,16PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size296KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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IDM29811JM/883C Overview

IC,SEQUENTIAL ADDRESS GENERATOR,S-TTL,DIP,16PIN,CERAMIC

IDM29811JM/883C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-STD-883 Class C
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

IDM29811JM/883C Related Products

	IDM29811JM/883C	IDM29811JC	IDM29811JM	IDM29811JM/883B	IDM29811JM/883	IDM29811NC
Description	IC,SEQUENTIAL ADDRESS GENERATOR,S-TTL,DIP,16PIN,CERAMIC	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP16, HERMETIC SEALED, DIP-16	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP16, HERMETIC SEALED, DIP-16	IC,SEQUENTIAL ADDRESS GENERATOR,S-TTL,DIP,16PIN,CERAMIC	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP16, HERMETIC SEALED, DIP-16	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP16, PLASTIC, DIP-16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-GDIP-T16	R-GDIP-T16	R-XDIP-T16	R-GDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	125 °C	70 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-	-55 °C	-55 °C	-55 °C	-
Package body material	CERAMIC	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO
technology	TTL	CMOS	CMOS	TTL	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1
Is Samacsys	N	N	N	N	N	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	-	5.08 mm	5.08 mm	-	5.08 mm	3.937 mm
Maximum slew rate	-	110 mA	110 mA	-	110 mA	110 mA
Maximum supply voltage	-	5.25 V	5.5 V	-	5.5 V	5.25 V
Minimum supply voltage	-	4.75 V	4.5 V	-	4.5 V	4.75 V
Nominal supply voltage	-	5 V	5 V	-	5 V	5 V
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	-	7.62 mm	7.62 mm	-	7.62 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	-	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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