A3PE3000L-1FGG896 datasheet, PDF

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A3PE3000L-1FGG896: DescriptionField Programmable Gate Array, 75264 CLBs, 3000000 Gates, 250MHz, 75264-Cell, CMOS, PBGA896, 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896; CategoryProgrammable logic devices Programmable logic; File Size7MB，224 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

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A3PE3000L-1FGG896 Overview

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 250MHz, 75264-Cell, CMOS, PBGA896, 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

A3PE3000L-1FGG896 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896
Reach Compliance Code	compliant
Is Samacsys	N
maximum clock frequency	250 MHz
JESD-30 code	S-PBGA-B896
JESD-609 code	e1
length	31 mm
Humidity sensitivity level	3
Configurable number of logic blocks	75264
Equivalent number of gates	3000000
Number of entries	620
Number of logical units	75264
Output times	620
Number of terminals	896
Maximum operating temperature	70 °C
Minimum operating temperature
organize	75264 CLBS, 3000000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA896,30X30,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	250
power supply	1.2/1.5,1.2/3.3 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	2.44 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	31 mm
Base Number Matches	1

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Revision 9

ProASIC3L Low Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

• Dramatic Reduction in Dynamic and Static Power Savings

• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power

• Low Power Consumption in Flash*Freeze Mode Allows for

Instantaneous Entry to / Exit from Low-Power Flash*Freeze

Mode

• Supports Single-Voltage System Operation

• Low-Impedance Switches

High Capacity

• 250,000 to 3,000,000 System Gates

• Up to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Live-at-Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II (A3PE3000L only)

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Wide Range Power Supply Voltage Support per JESD8-12,

Allowing I/Os to Operate from 1.14 V to 1.575 V

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold-Sparing I/Os Programmable Output

Slew Rate and Drive Strength

• Programmable Input Delay (A3PE3000L only)

• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC

3L Family

(except PQ208)

High Performance

• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System

Performance

• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit

PCI (1.2 V systems)

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All

with Integrated PLL (ProASIC3EL)

• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,

and External Feedback

• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V

systems) and 350 MHz (1.5 V systems))

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

to Secure FPGA Contents

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous

Operation:

– 250 MHz: For 1.2 V systems

– 350 MHz: For 1.5 V systems

• ARM Cortex™-M1 Soft Processor Available with or without

Debug

A3P1000L

M1A3P1000L

1,000,000

24,576

144

Yes

300

A3PE3000L

M1A3PE3000L

3,000,000

75,264

504

112

Yes

620

PQ208

FG324, FG484, FG896

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

Advanced and Pro (Professional) I/Os

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 8 Banks per Chip

ARM

Processor Support in ProASIC3L FPGAs

Table 1 • ProASIC3 Low-Power Product Family

ProASIC3L Devices

A3P250L

A3P600L

ARM Cortex-M1 Devices

M1A3P600L

System Gates

250,000

600,000

VersaTiles (D-flip-flops)

6,144

13,824

RAM Kbits (1,024 bits)

108

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

Yes

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os

157

235

Package Pins

VQFP

VQ100

PQFP

PQ208

FBGA

FG144, FG256

FG144, FG256, FG484

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. AES is not available for ARM Cortex-M1 ProASIC3L devices.

3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.

PQ208

FG144, FG256, FG484

February 2009

ProASIC3L Low Power Flash FPGAs

Table of Contents

ProASIC3L Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3L DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-115

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-121

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-126

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-128

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-143

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-144

Package Pin Assignments

100-Pin VQFP

208-Pin PQFP

144-Pin FBGA

256-Pin FBGA

324-Pin FBGA

484-Pin FBGA

896-Pin FBGA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4

Revision 9

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