DP3ED16MX8R8Y5-DP-XX50C datasheet, PDF

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DP3ED16MX8R8Y5-DP-XX50C: DescriptionEDO DRAM Module, 16MX8, 50ns, CMOS, LEADLESS MODULE, TSOP-32; Categorystorage storage; File Size198KB，2 Pages; ManufacturerB&B Electronics Manufacturing Company

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DP3ED16MX8R8Y5-DP-XX50C Overview

EDO DRAM Module, 16MX8, 50ns, CMOS, LEADLESS MODULE, TSOP-32

DP3ED16MX8R8Y5-DP-XX50C Parametric

Parameter Name	Attribute value
Parts packaging code	MODULE
package instruction	,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
access mode	FAST PAGE WITH EDO
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-XDMA-N32
memory density	134217728 bit
Memory IC Type	EDO DRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX8
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL
Base Number Matches	1

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16Mx8, 50 - 60ns, TSOP Stack

30A199-00

B

High Density Memory Device

PRELIMINARY

M-Densus

128 Megabit CMOS

3.3V EDO DRAM

DP3ED16MX8Rn5

DESCRIPTION:

The

M-Densus

series is a family of interchangeable memory

modules. The 64 Megabit DRAM is a member of this family

which utilizes the new and innovative space saving TSOP

technology. The module is constructed with two 16 Meg x

4 EDO, 3.3 Volt DRAM’s available in a 128 Megabit

compatible pin-out.

The 64 Megabit based

M-Densus

modules have been

designed to fit in the same footprint as the 16 Meg x 8 DRAM

TSOP monolithic. This allows the memory board designer to

upgrade the memory in their products without redesigning the

memory board, thus saving time and money.

FEATURES:

•

Configurations Available:

128 Megabit: 16 Meg x 8

•

Access Times: 50, 60ns (max.)

•

3.3 Volt Supply

•

Common Data Inputs and Outputs

•

Extended Data Out Capability (EDO)

•

4K/8K 64ms Refresh

•

3 Variations of Refresh:

- RAS only Refresh

- CAS before RAS Refresh

- Hidden Refresh

•

Package: Leadless TSOP Module

PIN NAMES

A0 - A11

A0 - A12*

DQ0 - DQ7

CAS

RAS

WE

OE

V

DD

V

SS

N.C.

Row Address:

A0 - A11

Column Address: A0 - A11

Refresh Address: A0 - A11

Row Address:

A0 - A12

Column Address: A0 - A10

Refresh Address: A0 - A12

Data In / Data Out

Column Address Strobe

Row Address Enable

Data Write Enable

Data Output Enable

Power Supply (+3.3V)

Ground

No Connect

PIN-OUT DIAGRAM

FUNCTIONAL BLOCK DIAGRAM

*

A12 for 8K refresh device.

30A199-00

REV. B

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

1

DP3ED16MX8R8Y5-DP-XX50C Related Products

	DP3ED16MX8R8Y5-DP-XX50C	DP3ED16MX8R8Y5-DP-XX60C	DP3ED16MX8RY5-DP-XX60C	DP3ED16MX8RY5-DP-XX50C
Description	EDO DRAM Module, 16MX8, 50ns, CMOS, LEADLESS MODULE, TSOP-32	EDO DRAM Module, 16MX8, 60ns, CMOS, LEADLESS MODULE, TSOP-32	EDO DRAM Module, 16MX8, 60ns, CMOS, LEADLESS MODULE, TSOP-32	EDO DRAM Module, 16MX8, 50ns, CMOS, LEADLESS MODULE, TSOP-32
Parts packaging code	MODULE	MODULE	MODULE	MODULE
Contacts	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	50 ns	60 ns	60 ns	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-XDMA-N32	R-XDMA-N32	R-XDMA-N32	R-XDMA-N32
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	32	32	32	32
word count	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	16MX8	16MX8	16MX8	16MX8
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL

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