MC74HC04A
Hex Inverter
High−Performance Silicon−Gate CMOS
The MC74HC04A is identical in pinout to the LS04 and the
MC14069. The device inputs are compatible with Standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL
outputs.
The device consists of six three−stage inverters.
Features
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MARKING
DIAGRAMS
14
14
1
SOIC−14
D SUFFIX
CASE 751A
1
14
14
1
TSSOP−14
DT SUFFIX
CASE 948G
1
HC
04A
ALYWG
G
HC04AG
AWLYWW
•
•
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1
mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With the JEDEC Standard No. 7A Requirements
Chip Complexity: 36 FETs or 9 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
LOGIC DIAGRAM
A1
1
2
Y1
A
L, WL
Y, YY
W, WW
G or
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
A2
3
4
(Note: Microdot may be in either location)
Y2
A3
5
6
Y3
Y=A
FUNCTION TABLE
Inputs
A
Outputs
Y
H
L
A4
9
8
Y4
L
H
A5
11
10
Y5
A6
13
12
Y6
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Pinout: 14−Lead Packages
(Top View)
V
CC
14
A6
13
Y6
12
A5
11
Y5
10
A4
9
Y4
8
1
A1
2
Y1
3
A2
4
Y2
5
A3
6
Y3
7
GND
1
Publication Order Number:
MC74HC04A/D
©
Semiconductor Components Industries, LLC, 2013
October, 2013
−
Rev. 14
MC74HC04A
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MAXIMUM RATINGS
Symbol
V
CC
V
in
I
in
V
out
I
out
P
D
Parameter
Value
Unit
V
V
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Output Current, per Pin
– 0.5 to + 7.0
– 0.5 to V
CC
+ 0.5
– 0.5 to V
CC
+ 0.5
±
20
±
25
±
50
500
450
mA
mA
mA
I
CC
DC Supply Current, V
CC
and GND Pins
Power Dissipation in Still Air,
Storage Temperature
SOIC Package†
TSSOP Package†
mW
_C
_C
T
stg
T
L
– 65 to + 150
260
Lead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be
taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, V
in
and
V
out
should be constrained to the range GND
v
(V
in
or V
out
)
v
V
CC
. Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either GND or V
CC
). Unused outputs must be left open.
†Derating
−
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package:
−
6.1 mW/_C from 65_ to 125_C
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Symbol
V
CC
T
A
V
in
, V
out
t
r
, t
f
Parameter
Min
2.0
0
0
0
0
Max
6.0
V
CC
Unit
V
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time
(Figure 1)
– 55
+ 125
1000
500
400
_C
ns
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
RECOMMENDED OPERATING CONDITIONS
ORDERING INFORMATION
Device
MC74HC04ADG
MC74HC04ADR2G
MC74HC04ADTR2G
NLV74HC04ADG*
NLV74HC04ADR2G*
NLV74HC04ADTR2G*
Package
Shipping
†
SOIC−14
(Pb−Free)
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
SOIC−14
(Pb−Free)
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
55 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
55 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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2
MC74HC04A
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
D
14
8
A
B
A3
E
L
H
1
7
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
_
7
_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0
_
7
_
0.25
M
B
M
13X
b
0.25
M
C A
A
S
B
S
X 45
_
h
DETAIL A
e
A1
C
M
SEATING
PLANE
SOLDERING FOOTPRINT*
6.50
1
14X
1.18
1.27
PITCH
0.58
14X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
Test/Measurement
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