HD6433826SXXXF datasheet, PDF - EEWORLD Datasheet

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HD6433826SXXXF: Description8-BIT, MROM, 5MHz, MICROCONTROLLER, PQFP80, QFP-80; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，581 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD6433826SXXXF Overview

8-BIT, MROM, 5MHz, MICROCONTROLLER, PQFP80, QFP-80

HD6433826SXXXF Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	QFP,
Contacts	80
Reach Compliance Code	compliant
Is Samacsys	N
Has ADC	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY
Address bus width
bit size	8
maximum clock frequency	10 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PQFP-G80
JESD-609 code	e0
length	20 mm
Number of I/O lines	64
Number of terminals	80
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	3.1 mm
speed	5 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1.

Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but

there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or

property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement

of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1.

These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation

product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any

other rights, belonging to Renesas Technology Corporation or a third party.

2.

Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,

originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in

these materials.

3.

All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents

information on products at the time of publication of these materials, and are subject to change by Renesas Technology

Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product

information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies

or errors.

Please also pay attention to information published by Renesas Technology Corporation by various means, including the

Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).

4.

When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and

algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the

information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss

resulting from the information contained herein.

5.

Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used

under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an

authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater

use.

6.

The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these

materials.

7.

If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license

from the Japanese government and cannot be imported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is

prohibited.

8.

Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

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