MASK ROM, 256KX16, 200ns, CMOS, PDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Maximum access time | 200 ns |
| Spare memory width | 8 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | MASK ROM |
| memory width | 16 |
| Number of terminals | 40 |
| word count | 262144 words |
| character code | 256000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.04 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MB834200A-20P | MB834200A-20PFQ | |
|---|---|---|
| Description | MASK ROM, 256KX16, 200ns, CMOS, PDIP40, | MASK ROM, 256KX16, 200ns, CMOS, PQFP44 |
| Is it Rohs certified? | incompatible | incompatible |
| Parts packaging code | DIP | QFP |
| Contacts | 40 | 64 |
| Reach Compliance Code | compliant | compliant |
| Is Samacsys | N | N |
| Maximum access time | 200 ns | 200 ns |
| Spare memory width | 8 | 8 |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 |
| JESD-609 code | e0 | e0 |
| memory density | 4194304 bit | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM |
| memory width | 16 | 16 |
| Number of terminals | 40 | 44 |
| word count | 262144 words | 262144 words |
| character code | 256000 | 256000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 256KX16 | 256KX16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP |
| Encapsulate equivalent code | DIP40,.6 | QFP44,.7SQ,40 |
| Package shape | RECTANGULAR | SQUARE |
| Package form | IN-LINE | FLATPACK |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.04 mA | 0.04 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1 mm |
| Terminal location | DUAL | QUAD |
| Base Number Matches | 1 | 1 |