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BA6566FE2

Description
TELEPHONE SPEECH CKT, PDSO18, SOP-18
CategoryWireless rf/communication    Telecom circuit   
File Size164KB,10 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance  
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BA6566FE2 Overview

TELEPHONE SPEECH CKT, PDSO18, SOP-18

BA6566FE2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionSOP,
Contacts18
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeR-PDSO-G18
JESD-609 codee3/e2
length11.2 mm
Number of functions1
Number of terminals18
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.9 mm
surface mountYES
Telecom integrated circuit typesTELEPHONE SPEECH CKT
Terminal surfaceTIN/TIN COPPER
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width5.4 mm
Base Number Matches1
Communication ICs
Speech network
BA6566 / BA6566F / BA6566FP
The BA6566, BA6566F, and BA6566FP are speech network ICs which possess the basic functions required for handset
communications. In addition to amplifying signals from a transmitter and sending them to a telephone line, they amplify
only reception signals from a telephone line and drive the receiver. They also compensate for fluctuation in the volume
at which signals are transmitted and received, caused by the length of the telephone line (AGC).
FApplications
Telephones and telephone equipment
FFeatures
1) Can accommodate both dynamic and piezoelectric
receivers, simply by changing the circuit constant for
a wide dynamic reception range.
2) Automatic gain control (AGC) is used, based on the
transmission and reception telephone line current,
for easier compliance with communications stan-
dards.
FBlock
diagram
3) Erroneous operation caused by high-frequency elec-
trical wave interference is minimized.
4) An HSOP package is used, eliminating the need for
an attached transistor to dissipate heat. This means
that a common circuit can be shared when a DIP
package is used (BA6566FP).
217

BA6566FE2 Related Products

BA6566FE2 BA6566FPE2
Description TELEPHONE SPEECH CKT, PDSO18, SOP-18 TELEPHONE SPEECH CKT, PDSO26, POWER, HSOP-24
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Parts packaging code SOIC SOIC
package instruction SOP, HSSOP,
Contacts 18 24
Reach Compliance Code unknown unknown
Is Samacsys N N
JESD-30 code R-PDSO-G18 R-PDSO-G26
JESD-609 code e3/e2 e3/e2
length 11.2 mm 13.6 mm
Number of functions 1 1
Number of terminals 18 26
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP HSSOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.9 mm 2.11 mm
surface mount YES YES
Telecom integrated circuit types TELEPHONE SPEECH CKT TELEPHONE SPEECH CKT
Terminal surface TIN/TIN COPPER TIN/TIN COPPER
Terminal form GULL WING GULL WING
Terminal pitch 1.27 mm 0.8 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 10 10
width 5.4 mm 5.4 mm
Base Number Matches 1 1

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