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MBM29LV400BC-55PW

Description
FLASH MEMORY CMOS 4M (512K X 8/256K X 16) BIT
Categorystorage    storage   
File Size393KB,58 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

MBM29LV400BC-55PW Overview

FLASH MEMORY CMOS 4M (512K X 8/256K X 16) BIT

MBM29LV400BC-55PW Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionPLASTIC, SCSP-48
Contacts48
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time55 ns
Other featuresMINIMUM 100000 PROGRAM/ERASE CYCLES
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length4.67 mm
memory density4194304 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,7
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
organize256KX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA48,6X8,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width3.52 mm
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20862-8E
FLASH MEMORY
CMOS
4M (512K
×
8/256K
×
16) BIT
MBM29LV400TC/BC
-55/70/90
s
FEATURES
• Single 3.0 V read, program, and erase
Minimizes system level power requirements
• Compatible with JEDEC-standard commands
Uses same software commands as E
2
PROMs
• Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP(1) (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type)
44-pin SOP (Package suffix: PF)
48-pin CSOP (Package suffix: PCV)
48-ball FBGA (Package suffix: PBT)
48-ball SCSP (Package suffix: PW)
• Minimum 100,000 program/erase cycles
• High performance
55 ns maximum access time
• Sector erase architecture
One 8K word, two 4K words, one 16K word, and seven 32K words sectors in word mode
One 16K byte, two 8K bytes, one 32K byte, and seven 64K bytes sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
(Continued)
s
PRODUCT LINE UP
Part No.
Power Supply Voltage (V)
Max Address Access Time (ns)
Max CE Access Time (ns)
Max OE Access Time (ns)
MBM29LV400 TC/BC
-55
V
V
CC
= 3.3 V
+0.3 V
–0.3
-70
V
CC
= 3.0 V
70
70
30
+0.6 V
–0.3 V
-90
55
55
30
90
90
35
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