TMS320V643AGDK5 datasheet, PDF

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TMS320V643AGDK5: Description64-BIT, 75.19MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，164 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320V643AGDK5 Overview

64-BIT, 75.19MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548

TMS320V643AGDK5 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	FBGA,
Contacts	548
Reach Compliance Code	not_compliant
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23
barrel shifter	NO
boundary scan	YES
maximum clock frequency	75.19 MHz
External data bus width	64
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B548
JESD-609 code	e0
length	23 mm
low power mode	YES
Humidity sensitivity level	4
Number of terminals	548
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	220
Certification status	Not Qualified
Maximum seat height	2.8 mm
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	23 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS320V643AGDK5 Related Products

	TMS320V643AGDK5	TMS320M643AGDK6	TMS320M643AGNZ6	TMS320V643AGNZ5	TMS320M643AGNZ5
Description	64-BIT, 75.19MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548	64-BIT, 75.19MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548	64-BIT, 75.19MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548	64-BIT, 75.19MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548	64-BIT, 75.19MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	FBGA,	FBGA,	BGA,	BGA,	BGA,
Contacts	548	548	548	548	548
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23	23	23	23	23
barrel shifter	NO	NO	NO	NO	NO
boundary scan	YES	YES	YES	YES	YES
maximum clock frequency	75.19 MHz	75.19 MHz	75.19 MHz	75.19 MHz	75.19 MHz
External data bus width	64	64	64	64	64
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548
JESD-609 code	e0	e0	e0	e0	e0
length	23 mm	23 mm	27 mm	27 mm	27 mm
low power mode	YES	YES	YES	YES	YES
Humidity sensitivity level	4	4	4	4	4
Number of terminals	548	548	548	548	548
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	220	220	220	220	220
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.8 mm	2.8 mm	2.8 mm	2.8 mm	2.8 mm
Maximum supply voltage	1.26 V	1.44 V	1.44 V	1.26 V	1.26 V
Minimum supply voltage	1.14 V	1.36 V	1.36 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.4 V	1.4 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	23 mm	23 mm	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1	1	-	-
Maker	-	-	Texas Instruments	Texas Instruments	Texas Instruments

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