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LC549-CHIP

Description
Audio Amplifier, DIE
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size80KB,5 Pages
ManufacturerGennum ( Semtech )
Websitehttp://www.gennum.com
Download Datasheet Parametric Compare View All

LC549-CHIP Overview

Audio Amplifier, DIE

LC549-CHIP Parametric

Parameter NameAttribute value
Parts packaging codeDIE
package instructionDIE,
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeR-XUUC-N8
Number of terminals8
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationUPPER
Base Number Matches1
High Power Class B
Output Stage
LC549/LV549/LD549 DATA SHEET
FEATURES
40dB of electrical gain
1.0 to 1.6 VDC supply operating range
current trim capability (R
T
)
high efficiency class B output stage
may be used with a linear or compression preamplfier
STANDARD PACKAGING
• 8 pin MICROpac (LC549)
• 8 pin MINIpac
• 8 pin PLID
®
(LC549, LD549)
• Chip (47 x 40 mils) (LC549, LD549)
DESCRIPTION
The LC/LV/LD549 is an 8 pin, low voltage, push-pull audio
frequency output stage amplifier with a single unbalanced
input. The circuit utilizes two internal negative feedback
loops to stabilize the DC operating point for temperature
stability and to linearize the transfer function over a wide
dynamic range. The circuit operates near ideal class B
conditions resulting in low distortion and very low quiescent
current, required for extended battery life.
The LC549, LV549 and LD549 differ in only one respect;
the LV549 and LD549 are selected devices which are
capable of delivering from 10 mA to 41 mA and from 36 mA
to 75 mA of output current respectively. These values are
the maximum current drawn with both output stage transistors
in saturation. Thus the LD549 is capable of producing a
high output in a low impedance load, the LV549 is selected
to have lower peak currents, extending the life of the
battery.
R
T
3
V
B
6
5
OUTPUT 1
INPUT
2
8
OUTPUT 2
4
1
7
GND
DEC 1 DEC 2
U.S. Patent No. 4,085,382
Patented in other countries
BLOCK DIAGRAM
Revision Date: January 2001
Document No. 500 - 25 - 09
GENNUM CORPORATION P.O. Box 489, Stn A, Burlington, Ontario, Canada L7R 3Y3
Japan Branch: A-302 Miyamae Village, 2-10-42 Miyamae, Suginami-ku Tokyo 168, Japan
tel. (905) 632-2996 fax: (905) 632-5946
tel. (03) 3334-7700
fax: (03) 3247-8839

LC549-CHIP Related Products

LC549-CHIP LV549-MINI LC549-PLID LC549-MINI LC549-MICRO LD549-PLID LD549-MINI LD549-CHIP
Description Audio Amplifier, DIE Audio Amplifier, PDFP8, MINIPAK-8 Audio Amplifier, PDSO8, PLID, 8 PIN Audio Amplifier, PDFP8, MINIPAK-8 Audio Amplifier, PDFP8, MICROPAK-8 Audio Amplifier, PDSO8, PLID, 8 PIN Audio Amplifier, PDFP8, MINIPAK-8 Audio Amplifier, DIE
Parts packaging code DIE DFP SOIC DFP DFP SOIC DFP DIE
Contacts 8 8 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code R-XUUC-N8 R-PDFP-F8 R-PDSO-C8 R-PDFP-F8 R-PDFP-F8 R-PDSO-C8 R-PDFP-F8 R-XUUC-N8
Number of terminals 8 8 8 8 8 8 8 8
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP FLATPACK SMALL OUTLINE FLATPACK FLATPACK SMALL OUTLINE FLATPACK UNCASED CHIP
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES YES
Terminal form NO LEAD FLAT C BEND FLAT FLAT C BEND FLAT NO LEAD
Terminal location UPPER DUAL DUAL DUAL DUAL DUAL DUAL UPPER
Base Number Matches 1 1 1 1 1 1 1 1
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