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UPD4564441G5-A75-9JF

Description
IC,SDRAM,4X4MX4,CMOS,TSOP,54PIN,PLASTIC
Categorystorage    storage   
File Size496KB,68 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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UPD4564441G5-A75-9JF Overview

IC,SDRAM,4X4MX4,CMOS,TSOP,54PIN,PLASTIC

UPD4564441G5-A75-9JF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionTSOP, TSOP54,.46,32
Reach Compliance Codeunknown
Maximum access time5.4 ns
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G54
JESD-609 codee0
memory density67108864 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width4
Number of terminals54
word count16777216 words
character code16000000
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Encapsulate equivalent codeTSOP54,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Continuous burst length1,2,4,8,FP
Maximum standby current0.0005 A
Maximum slew rate0.14 mA
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Base Number Matches1
DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD4564441-A75, 4564841-A75
64M-bit Synchronous DRAM, 133MHz
4-bank, LVTTL
Description
The
µ
PD4564441-A75, 4564841-A75 are high-speed 67,108,864-bit synchronous dynamic random-access
memories, organized as 4,194,304
×
4
×
4 and 2,097,152
×
8
×
4 (word
×
bit
×
bank), respectively.
The synchronous DRAMs achieved high-speed data transfer using the pipeline architecture.
All inputs and outputs are synchronized with the positive edge of the clock.
The synchronous DRAMs are compatible with Low Voltage TTL (LVTTL).
These products are packaged in 54-pin plastic TSOP (II).
Features
Fully Synchronous Dynamic RAM, with all signals referenced to a positive clock edge
Pulsed interface
Possible to assert random column address in every cycle
Quad internal banks controlled by A12 and A13 (Bank Select)
Programmable Wrap sequence (Sequential / Interleave)
Programmable burst length (1, 2, 4, 8 and full page)
/CAS latency (3)
Automatic precharge and controlled precharge
CBR (auto) refresh and self refresh
• ×4, ×8
organization
Single 3.3 V
±
0.3 V power supply
LVTTL compatible inputs and outputs
4,096 refresh cycles / 64 ms
Burst termination by Burst stop command and Precharge command
Ordering Information
Part number
Organization
(word
×
bit
×
bank)
4M
×
4
×
4
2M
×
8
×
4
Clock frequency
MHz (MAX.)
133
Package
54-pin Plastic TSOP (II)
(10.16mm (400))
µ
PD4564441G5-A75-9JF
µ
PD4564841G5-A75-9JF
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M13977EJ5V0DS00 (5th edition)
Date Published January 2000 NS CP (K)
Printed in Japan
The mark
shows major revised points.
©
1998

UPD4564441G5-A75-9JF Related Products

UPD4564441G5-A75-9JF UPD4564841G5-A75-9JF
Description IC,SDRAM,4X4MX4,CMOS,TSOP,54PIN,PLASTIC IC,SDRAM,4X2MX8,CMOS,TSOP,54PIN,PLASTIC
Is it Rohs certified? incompatible incompatible
package instruction TSOP, TSOP54,.46,32 TSOP, TSOP54,.46,32
Reach Compliance Code unknown unknown
Maximum access time 5.4 ns 5.4 ns
Maximum clock frequency (fCLK) 133 MHz 133 MHz
I/O type COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8
JESD-30 code R-PDSO-G54 R-PDSO-G54
JESD-609 code e0 e0
memory density 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 4 8
Number of terminals 54 54
word count 16777216 words 8388608 words
character code 16000000 8000000
Maximum operating temperature 70 °C 70 °C
organize 16MX4 8MX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP TSOP
Encapsulate equivalent code TSOP54,.46,32 TSOP54,.46,32
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 4096 4096
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.0005 A 0.0005 A
Maximum slew rate 0.14 mA 0.14 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm
Terminal location DUAL DUAL
Base Number Matches 1 1

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