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NPI23S101MTRB

Description
General Purpose Inductor, 100uH, 20%, 1 Element, SMD,
CategoryPassive components    inductor   
File Size224KB,4 Pages
ManufacturerNichicon
Websitehttp://www.nichicon.co.jp
Download Datasheet Parametric View All

NPI23S101MTRB Overview

General Purpose Inductor, 100uH, 20%, 1 Element, SMD,

NPI23S101MTRB Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
ECCN codeEAR99
DC Resistance3.2 Ω
Nominal inductance(L)100 µH
Inductor ApplicationsPOWER INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Number of functions1
Number of terminals4
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Maximum rated current0.16 A
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTIN LEAD
Terminal locationDUAL IN-LINE
Terminal shapeONE SURFACE
Test frequency0.1 MHz
Tolerance20%
Base Number Matches1
NPI Power Inductors
FEATURES
• MINIATURE SIZE (6.5mm X 5.2mm)
• LOW PROFILE (1.05mm ~ 2.55mm MAXIMUM HEIGHT)
• SURFACE MOUNTABLE CONSTRUCTION
• TAPED AND REELED FOR AUTOMATIC INSERTION
CHARACTERISTICS
Case Size
Inductance Range
Inductance Tolerance
Operating Temperature Range
Inductance Change at Isat
Temperature Rise at Isat
Resistance to Solder Heat
NPI21S
NPI22S
NPI23S
100µH ~ 1,000µH
±20% (M)
-25°C ~ +85°C
-10% max.
+40°C max.
260°C for 10 seconds (Inductance change ±10% max.)
2.2µH ~ 47µH
NPI__S Series
includes all homogeneous materials
*See Part Number System for Details
NPI24S
100µH ~ 3,300µH
RoHS
Compliant
CASE DIMENSIONS (mm)
Series
NPI21S
NPI22S
NPI23S
NPI24S
L
L
1
1
4
2
A
B
C
D
L
L
1
W
W
1
T
1.05 max.
1.25 max.
1.55 max.
2.55 max.
4.8±0.1 3.0 ±0.1 0.5 ±0.1 0.4 ±0.1 5.2 ±0.1 5.0 ±0.1 6.5 max. 5.0 ±0.1
A
C
3
4
PART NUMBER SYSTEM
NPI 21 S 220 M TR F
Termination Finish:
F = RoHS Compliant Pb-free (100%Sn)
B = Sn-Pb (Optional)
Packaging: TR = Tape & Reel
Inductance Tolerance Code: M=±20%
Inductance Code (µH): 1st two digits are significant,
3rd digit is multiplier for values from 10µH and up.
Construction Code (see drawing for details)
Size Code (see table for details)
Series
100
2
3
W
1
W B
1
D
Circuit Schematic
T
LAND PATTERN DIMENSIONS (mm)
Series
NPI_S
L
5.4
G
4.2
G
1
2.2
H
3.8
300
250
Temperature °C
200
150
100
50
Pre-Heat
150°C ~ 180°C
60 ~ 120 sec.
Time above 230°C
30 seconds max.
Cool Down
REFLOW SOLDERING PROFILE
Soldering 260°C max.
5 seconds max.
L
H
G
25
30
60
90 120 150 180 210 240 270 300
Time - Seconds
®
48
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
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