HFCT-5953xxxZ/HFCT-5954xxxZ
Single Mode SFF Transceivers for SONET OC-12/SDH STM-4 (S4.1)
Multirate Operation
Part of the Avago METRAK family
Datasheet
Description
The HFCT-5953xxxZ/HFCT-5954xxxZ SFF
transceivers are high performance, cost effective
modules for serial optical data communication
applications specified at 622 Mbit/s for Intermediate
Reach links. They are designed to allow multirate
transmission at OC3 (155 Mbit/s) and OC12 (622
Mbit/s) providing OC12 SONET/SDH compliance.
All modules are designed for single mode fiber and
operate at a nominal wavelength of 1300 nm. They
incorporate high performance, reliable, long
wavelength optical device and proven circuit
technology to give long life and consistent service.
The transmitter section consists of a Fabry Perot
Laser (FP). The transmitter has full IEC 825 and
CDRH Class 1 eye safety.
The receiver section uses a MOVPE grown planar
PIN photodetector for low dark current and
excellent responsivity.
A pseudo-ECL logic interface simplifies interface
to external circuitry.
These transceivers are supplied in 2 x 5 and 2 x
10 DIP style footprint with the LC fiber connector
interface and are fully compliant with SFF Multi
Source Agreement (MSA).
Features
•
RoHS Compliant
•
Multirate operation from
155 Mbit/s to 622 Mbit/s and OC-12 SONET compliance
•
HFCT-5953xxxZ/HFCT-5954xxxZ are compliant to the
intermediate reach SONET OC12/SDH STM-4 (S4.1)
specifications
•
Multisourced 2 x 5 and 2 x 10 package styles with LC
receptacle
•
Single +3.3 V power supply
•
Temperature range:
0°C to +70°C
HFCT-595xTLZ/TGZ
-40°C to +85°C HFCT-595xATLZ/ATGZ
•
Wave solder and aqueous wash process compatible
•
Manufactured in an ISO9002 certified facility
•
Performance
HFCT-5953xxxZ/HFCT-5954xxxZ:
Links of 15 km with 9/125 µm SMF
•
Fully Class 1 CDRH/IEC 825 compliant
•
Pin Outs:
HFCT-5953xxxZ 2 x 5
HFCT-5954xxxZ 2 x 10
Applications
•
SONET/SDH equipment interconnect,
STS-12/SDH STM-4 rate
•
Multirate Client Interface on Metro Gateways and Edge
Switches
Functional Description
Receiver Section
Design
The receiver section contains an InGaAs/InP
photo detector and a preamplifier mounted in an
optical subassembly. This optical subassembly is
coupled to a postamp/decision circuit.
The postamplifier is ac coupled to the preamplifier
as illustrated in Figure 1. The coupling capacitors
are large enough to pass the SONET/SDH test
pattern at 622 MBd without significant distortion
or performance penalty. If a lower signal rate, or
a code which has significantly more low frequency
content is used, sensitivity, jitter and pulse
distortion could be degraded.
Figure 1 also shows a filter function which limits
the bandwidth of the preamp output signal. The
filter is designed to bandlimit the preamp output
noise and thus improve the receiver sensitivity.
These components will reduce the sensitivity of
the receiver as the signal bit rate is increased
above 622 Mb/s.
The device incorporates a photodetector bias
circuit. This output must be connected to V
CC
and
can be monitored by connecting through a series
resistor (see application section).
Noise Immunity
The receiver includes internal circuit components
to filter power supply noise. However under some
conditions of EMI and power supply noise,
external power supply filtering may be necessary
(see application section).
The Signal Detect Circuit
The signal detect circuit works by sensing the peak
level of the received signal and comparing this
level to a reference. The SD output is low voltage
TTL.
PHOTODETECTOR
BIAS
TRANS-
IMPEDANCE
PRE-
AMPLIFIER
FILTER
AMPLIFIER
DATA OUT
PECL
OUTPUT
BUFFER
DATA OUT
GND
SIGNAL
DETECT
CIRCUIT
TTL
OUTPUT
BUFFER
SD
Figure 1 - Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
The transmitter section uses a Fabry Perot (FP)
laser as its optical source, see Figure 2. The
package has been designed to be compliant with
IEC 825 eye safety requirements under any single
fault condition. The optical output is controlled
by a custom IC that detects the laser output via
the monitor photodiode. This IC provides both dc
and ac current drive to the laser to ensure correct
modulation, eye diagram and extinction ratio over
temperature, supply voltage and operating life.
The transmitter section also includes monitor
circuitry for both the laser diode bias current and
laser diode optical power.
FP
LASER
DATA
DATA
PECL
INPUT
PHOTODIODE
(rear facet monitor)
Note 1
LASER
MODULATOR
B
MON
(+)
B
MON
(-)
Note 1
LASER BIAS
DRIVER
LASER BIAS
CONTROL
P
MON
(+)
P
MON
(-)
Note 1
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Figure 2 - Simplified Transmitter Schematic
3
Package
The overall package concept for the Avago transceiver
consists of four basic elements; two optical
subassemblies and two electrical subassemblies.
They are housed as illustrated in the block diagram
in Figure 3.
The package outline drawing and pin out are
shown in Figures 4, 5 and 6. The details of this
package outline and pin out are compliant with the
multisource definition of the 2 x 5 and 2 x 10 DIP.
The electrical subassemblies consist of high
volume multilayer printed circuit boards on which
the IC and various surface-mounted passive
circuit elements are attached.
The receiver electrical subassembly includes an
internal shield for the electrical and optical
subassemblies to ensure high immunity to external
EMI fields.
The optical subassemblies are each attached to
their respective transmit or receive electrical
subassemblies. These two units are than fitted
within the outer housing of the transceiver that is
molded of filled nonconductive plastic to provide
mechanical strength. The housing is then encased
with a metal EMI protective shield. Four ground
connections are provided for connecting the EMI
shield to signal ground.
The PCB’s for the two electrical subassemblies
both carry the signal pins that exit from the bottom
of the transceiver. The solder posts are fastened
into the molding of the device and are designed to
provide the mechanical strength required to
withstand the loads imposed on the transceiver by
mating with the LC connectored fiber cables.
Although they are not connected electrically to the
transceiver, it is recommended to connect them to
chassis ground.
R
X
SUPPLY
Note 3
PHOTO DETECTOR
BIAS Note 2
DATA OUT
QUANTIZER IC
DATA OUT
SIGNAL
DETECT
T
X
GROUND
DATA IN
DATA IN
Tx DISABLE
B
MON
(+) Note 1
B
MON
(-) Note 1
P
MON
(+) Note 1
P
MON
(-) Note 1
R
X
GROUND
Note 1
LASER BIAS
MONITORING
LASER DRIVER
AND CONTROL
CIRCUIT
LASER DIODE
OUTPUT POWER
MONITORING
Note 1
LASER
OPTICAL
SUBASSEMBLY
LC
RECEPTACLE
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
T
X
SUPPLY
CASE
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO R
X
V
CC
IN 2 x 5 DESIGN
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3 - Block Diagram.
4
15.0 ± 0.2
(0.591 ± 0.008)
(
13.59 + 0
- 0.2
0.535 +0
-0.008
)
TOP VIEW
13.59
(0.535)
MAX
6.25
(0.246)
10.8 ± 0.2
(0.425 ± 0.008)
48.5 ± 0.2
(1.91 ± 0.008)
4.06 ± 0.1
(0.16 ± 0.004)
9.8
(0.386)
MAX
3.81 ± 0.15
(0.15 ± 0.006)
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
48.5 ± 0.2
(1.91 ± 0.008)
10.16 ± 0.1
(0.4 ± 0.004)
FRONT VIEW
9.6 ± 0.2
(0.378 ±0.008)
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1.78 ± 0.1
(0.07 ± 0.004)
1 ± 0.1
(0.039 ± 0.004)
BACK VIEW
G MODULE - NO EMI NOSE SHIELD
9.8
(0.386)
MAX
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
3.81 ± 0.1
(0.15 ± 0.004)
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1.78 ± 0.1
(0.07 ± 0.004)
20 x 0.25 ± 0.1
(PIN THICKNESS)
(0.01 ± 0.004)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4 - HFCT-5953xxxZ/HFCT-5954xxxZ Package Outline Drawing (2 x 10 Design shown)
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