To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HB28B2000A8H/HB28B1000A8H
HB28B640A8H/HB28B512A8H
HB28B448A8H/HB28B320A8H
HB28B256A8H/HB28B192A8H
HB28B128A8H/HB28B064A8H
FLASH ATA Card
2 GByte/1 GByte/640 MByte/512 MByte/448 MByte
320 MByte/256 MByte/192 MByte/128 MByte
64 MByte
ADE-203-1345B (Z)
Rev. 2.0
Sep. 2, 2002
Description
HB28B2000A8H, HB28B1000A8H, HB28B640A8H, HB28B512A8H, HB28B448A8H, HB28B320A8H,
HB28B256A8H, HB28B192A8H, HB28B128A8H, HB288064A8H are Flash ATA card. This card complies
with PC card ATA standard and is suitable for the usage of data storage memory medium for PC or any other
electric equipment. This card is equipped with 0.18
µm
CMOS 512 Mega bit Flash memory. This card is
suitable for ISA (Industry Standard Architecture) bus interface standard , and read/write unit is 1 sector (512
bytes) sequential access. By using this card it is possible to operate good performance for the system which
have PC card slots.
Features
•
PC card ATA standard specification
68 pin two pieces connector and Type II (5 mm)
•
3.3 V/5 V single power supply operation
•
ISA standard and Read/Write unit is 512 bytes (sector) sequential access
Sector Read/Write transfer rate: 8MB/sec burst
HB28B2000/1000/640/512/448/320/256/192/128/064A8H
•
Card density is 2 Giga bytes maximum
This card is equipped 0.18
µm
CMOS 512 Mega bit Flash memory
•
3 variations of mode access
Memory card mode
I/O card mode
True IDE mode
•
Internal self-diagnostic program operates at V
CC
power on
•
High reliability based on internal ECC (Error Correcting Code) function
•
Auto Sleep Function
•
Data write is 300,000 cycles/block.*
1
Note: 1. One block consists of four sectors (512 byte
×
4).
Card Line Up*
1
Type No.
HB28B2000A8H
HB28B1000A8H
HB28B640A8H
HB28B512A8H
HB28B448A8H
HB28B320A8H
HB28B256A8H
HB28B192A8H
HB28B128A8H
HB28B064A8H
Notes: 1.
2.
3.
4.
Card density Capacity*
4
2 GB
1 GB
640 MB
512 MB
448 MB
320 MB
256 MB
192 MB
128 MB
64 MB
2,050,965,504 byte
1,025,482,752 byte
640,475,136 byte
512,483,328 byte
448,519,680 byte
320,409,600 byte
256,204,800 byte
192,184,320 byte
128,188,416 byte
64,094,208 byte
Total sectors/ Sectors/ Number of
card*
3
track*
2
head
4,005,792
2,002,896
1,250,928
1,000,944
876,015
625,800
500,400
375,360
250,368
125,184
63
63
63
63
63
56
48
32
32
32
16
16
16
16
15
15
15
15
8
4
Number of
cylinder
3974
1987
1241
993
927
745
695
782
978
978
These data are written in ID.
Total tracks = number of head
×
number of cylinder.
Total sectors/card = sectors/track
×
number of head
×
number of cylinder.
It is the logical address capacity including the area which is used for file system.
2
DSP and ARM Processors
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