NM27LV210FE150 datasheet, PDF - EEWORLD Datasheet

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NM27LV210FE150: DescriptionIC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM; Categorystorage storage; File Size480KB，8 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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NM27LV210FE150 Overview

IC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM

NM27LV210FE150 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	LQFP, QFP44,.47SQ,32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
I/O type	COMMON
JESD-30 code	S-PQFP-G44
JESD-609 code	e0
length	10 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP44,.47SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.00002 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
Base Number Matches	1

NM27LV210FE150 Related Products

	NM27LV210FE150	NM27LV210F250	NM27LV210VE200	NM27LV210VE150	NM27LV210FE200	NM27LV210V150	NM27LV210F150	NM27LV210F200	NM27LV210FE250
Description	IC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM	IC 64K X 16 OTPROM, 250 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM	IC 64K X 16 OTPROM, 200 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM	IC 64K X 16 OTPROM, 150 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM	IC 64K X 16 OTPROM, 200 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM	IC 64K X 16 OTPROM, 150 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM	IC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM	IC 64K X 16 OTPROM, 200 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM	IC 64K X 16 OTPROM, 250 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	LQFP, QFP44,.47SQ,32	LQFP, QFP44,.47SQ,32	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	LQFP, QFP44,.47SQ,32	PLASTIC, LCC-44	LQFP, QFP44,.47SQ,32	LQFP, QFP44,.47SQ,32	LQFP, QFP44,.47SQ,32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	250 ns	200 ns	150 ns	200 ns	150 ns	150 ns	200 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQFP-G44	S-PQFP-G44	S-PQCC-J44	S-PQCC-J44	S-PQFP-G44	S-PQCC-J44	S-PQFP-G44	S-PQFP-G44	S-PQFP-G44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	10 mm	10 mm	16.51 mm	16.51 mm	10 mm	16.51 mm	10 mm	10 mm	10 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44	44	44	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-	-	-	-40 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	QCCJ	QCCJ	LQFP	QCCJ	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP44,.47SQ,32	QFP44,.47SQ,32	LDCC44,.7SQ	LDCC44,.7SQ	QFP44,.47SQ,32	LDCC44,.7SQ	QFP44,.47SQ,32	QFP44,.47SQ,32	QFP44,.47SQ,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	CHIP CARRIER	CHIP CARRIER	FLATPACK, LOW PROFILE	CHIP CARRIER	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	4.57 mm	4.57 mm	1.6 mm	4.57 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	J BEND	J BEND	GULL WING	J BEND	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	1.27 mm	1.27 mm	0.8 mm	1.27 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	10 mm	16.51 mm	16.51 mm	10 mm	16.51 mm	10 mm	10 mm	10 mm
Maker	-	-	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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