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Datasheet> All Categories > storage> storage> M68AW256ML55ND1T
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M68AW256ML55ND1T

Description
4 Mbit (256K x16) 3.0V Asynchronous SRAM
Categorystorage    storage   
File Size147KB，23 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

M68AW256ML55ND1T Overview

4 Mbit (256K x16) 3.0V Asynchronous SRAM

M68AW256ML55ND1T Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeTSOP2
package instructionPLASTIC, TSOP2-44
Contacts44
Reach Compliance Code_compli
ECCN code3A991.B.2.A
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.41 mm
memory density4194304 bi
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000009 A
Minimum standby current1.5 V
Maximum slew rate0.026 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

M68AW256ML55ND1T Preview

M68AW256M
4 Mbit (256K x16) 3.0V Asynchronous SRAM
FEATURES SUMMARY
■
■
■
■
■
■
■
■
■
SUPPLY VOLTAGE: 2.7 to 3.6V
256K x 16 bits SRAM with OUTPUT ENABLE
EQUAL CYCLE and ACCESS TIME: 55ns,
70ns
SINGLE BYTE READ/WRITE
LOW STANDBY CURRENT
LOW V
CC
DATA RETENTION: 1.5V
TRI-STATE COMMON I/O
AUTOMATIC POWER DOWN
TSOP44, and TFBGA48 PACKAGES
– Compliant with Lead-Free Soldering Pro-
cesses
– Standard or Lead-Free Option
Figure 1. Packges
44
1
TSOP44 Type II (ND)
FBGA
TFBGA48 (ZH)
6 x 8mm
FBGA
TFBGA48 (ZB)
7 x 8mm
April 2004
1/23
M68AW256M
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2.
Table 1.
Figure 3.
Figure 4.
Figure 5.
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Standby/Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. AC Measurement Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Address Controlled, Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms.. . . . . . . . . . . . . 12
Figure 10.Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms . . . . . . . . . . . . . . . . . 12
Table 7. Read and Standby Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11.Write Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12.Chip Enable Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13.UB/LB Controlled, Write AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 8. Write Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 14.Low V
CC
Data Retention AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 9. Low V
CC
Data Retention Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 15.TSOP44 II - 44 lead Plastic Thin Small Outline Type II, Package Outline . . . . . . . . . . . 18
Table 10. TSOP 44 II - 44 lead Plastic Thin Small Outline Type II, Package Mechanical Data . . . 18
Figure 16.TFBGA48 6x8mm - 6x8 active ball array, 0.75 mm pitch, Bottom View Package Outline19
Table 11. TFBGA48 6x8mm - 6x8 active ball array, 0.75 mm pitch, Package Mechanical Data . . 19
Figure 17.TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Bottom View Package Outline. . . . . 20
2/23
M68AW256M
Table 12. TFBGA48 7x8mm - 6x8 ball array, 0.75 mm pitch, Package Mechanical Data. . . . . . . . 20
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 13. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3/23
M68AW256M
SUMMARY DESCRIPTION
The M68AW256M is a 4 Mbit (4,194,304 bit)
CMOS SRAM, organized as 262,144 words by 16
bits. The device features fully static operation re-
quiring no external clocks or timing strobes, with
equal address access and cycle times. It requires
a single 2.7 to 3.6V supply. This device has an au-
tomatic power-down feature, reducing the power
consumption by over 99% when deselected.
The M68AW256 is available in TFBGA48 (6x8mm
- 6x8 active ball array, 0.75mm pitch), TFBGA48
(7x8mm - 6x8 active ball array, 0.75 mm pitch) and
in TSOP44 Type II packages.
In addition to the standard version, both packages
are also available in Lead-free version, in compli-
ance with the JEDEC Std J-STD-020B, the ST
ECOPACK 7191395 Specification, and the RoHS
(Restriction of Hazardous Substances) directive.
All packages are compliant with Lead-free solder-
ing processes.
Figure 2. Logic Diagram
VCC
Table 1. Signal Names
A0-A17
DQ0-DQ15
Address Inputs
Data Input/Output
Chip Enable
Output Enable
Write Enable
Upper Byte Enable Input
Lower Byte Enable Input
Supply Voltage
Ground
Not Connected Internally
Don’t Use as Internally Connected
18
A0-A17
W
16
DQ0-DQ15
E
G
W
UB
E
M68AW256M
G
UB
LB
LB
V
CC
V
SS
NC
DU
VSS
AI04870b
4/23
M68AW256M
Figure 3. TSOP Connections
A4
A3
A2
A1
A0
E
DQ0
DQ1
DQ2
DQ3
VCC
VSS
DQ4
DQ5
DQ6
DQ7
W
A16
A15
A14
A13
A12
44
1
2
43
42
3
4
41
5
40
6
39
7
38
8
37
9
36
10
35
11
34
M68AW256M
12
33
13
32
14
31
15
30
16
29
28
17
27
18
26
19
25
20
24
21
23
22
AI04871b
A5
A6
A7
G
UB
LB
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
NC
A8
A9
A10
A11
A17
5/23
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