BAV301 - BAV303
SURFACE MOUNT SWITCHING DIODE
Features
·
·
·
·
·
Fast Switching Speed
Surface Mount Package Ideally Suited for
Automatic Insertion
For General Purpose Switching Applications
High Conductance
Fits on SOD-323 / SOT-23 Footprint
A
B
Mechanical Data
·
·
·
·
·
Case: MicroMELF, Glass
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Marking: Cathode Band Only
Weight: 0.012 grams (approx.)
Dim
A
B
C
MicroMELF
Min
1.8
1.20
Max
2.0
1.25
1.35Æ Typical
All Dimensions in mm
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t < 1.0s
Power Dissipation
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
O
I
FSM
P
d
R
qJA
T
j
, T
STG
BAV301
120
100
71
BAV302
200
150
106
250
125
1.0
500
300
-65 to +175
BAV303
250
200
141
Unit
V
V
V
mA
mA
A
mW
K/W
°C
Electrical Characteristics
Characteristic
Maximum Forward Voltage
Maximum Peak Reverse Current
@ Rated DC Blocking Voltage
Junction Capacitance
Reverse Recovery Time
@ T
A
= 25°C unless otherwise specified
Symbol
V
FM
I
RM
C
j
t
rr
Min
¾
¾
¾
¾
Max
1.0
100
15
1.5
50
Unit
V
nA
mA
pF
ns
Test Condition
I
F
= 100mA
T
A
= 25°C
T
A
= 100°C
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 30mA,
I
rr
= 0.1 x I
R
, R
L
= 100W
Notes:
1. Valid provided that electrodes are kept at ambient temperature.
DS30013 Rev. C-3
1 of 2
C
D
BAV301-BAV303
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
1000
T
J
= 25ºC
100
I
R
, LEAKAGE CURRENT (nA)
100
10
10
1
1.0
0.1
0.1
0.01
0
1
2
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Forward Characteristics
1
0
100
200
T
j
, JUNCTION TEMPERATURE (°C)
Fig. 2 Leakage Current vs Junction Temperature
DS30013 Rev. C-3
2 of 2
BAV301-BAV303
MCU
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