STK16C68
8K x 8
AutoStorePlus™
nvSRAM
QuantumTrap™
CMOS
Nonvolatile Static RAM
Obsolete - Not Recommend for new Designs
FEATURES
• Internal Capacitor Guarantees
AutoStore™
Regardless of Power-Down Slew Rate
• Nonvolatile Storage without Battery Problems
• Directly Replaces 8K x 8 Static RAM, Battery-
Backed RAM or EEPROM
• 25ns, 35ns and 45ns Access Times
•
STORE
to Nonvolatile Elements Initiated by
Software or
AutoStorePlus™
on Power Down
•
RECALL
to SRAM Initiated by Software or
Power Restore
• 10mA Typical I
CC
at 200ns Cycle Time
• Unlimited READ, WRITE and
RECALL
Cycles
• 1,000,000
STORE
Cycles to Nonvolatile Ele-
ments
• 100-Year Data Retention over Full Industrial
Temperature Range
• No Data Loss from Undershoot
• Commercial and Industrial Temperatures
• 28-Pin 600 mil PDIP Package
DESCRIPTION
The STK16C68 is a fast
SRAM
with a nonvolatile ele-
ment incorporated in each static memory cell. The
SRAM
can be read and written an unlimited number of
times, while independent nonvolatile data resides in
Nonvolatile Elements. Data transfers from the
SRAM
to
the Nonvolatile Elements (the
STORE
operation) can
take place automatically on power down. An internal
capacitor guarantees the
STORE
operation regardless
of power-down slew rate. Transfers from the Nonvola-
tile Elements to the
SRAM
(the
RECALL
operation) take
place automatically on restoration of power. Initiation
of
STORE
and
RECALL
cycles can also be controlled by
entering control sequences on the
SRAM
inputs. The
STK16C68 is pin-compatible with 8k x 8
SRAM
s and
battery-backed
SRAM
s, allowing direct substitution
while enhancing performance. The STK12C68, which
uses an external capacitor, and the STK15C68, which
uses charge stored in system capacitance, are alter-
natives for systems needing
AutoStore™
operation.
BLOCK DIAGRAM
QUANTUM TRAP
128 x 512
V
CC
STORE/
RECALL
CONTROL
PIN CONFIGURATIONS
NC
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
0
DQ
1
DQ
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A
5
ROW DECODER
A
6
A
7
A
8
A
9
A
11
A
12
DQ
0
DQ
1
DQ
2
DQ
3
DQ
4
DQ
5
DQ
6
DQ
7
STORE
STATIC RAM
ARRAY
128 x 512
RECALL
POWER
CONTROL
INTERNAL
CAPACITOR
V
CC
W
NC
A
8
A
9
A
11
G
A
10
E
DQ
7
DQ
6
DQ
5
DQ
4
DQ
3
28 - 600 PDIP
INPUT BUFFERS
COLUMN I/O
COLUMN DEC
SOFTWARE
DETECT
A
0
- A
12
PIN NAMES
A
0
- A
12
W
Address Inputs
Write Enable
Data In/Out
Chip Enable
Output Enable
Power (+ 5V)
Ground
A
0
A
1
A
2
A
3
A
4
A
10
DQ
0
- DQ
7
G
E
W
E
G
V
CC
V
SS
March 2006
1
Document Control # ML0010 rev 0.2
STK16C68
ABSOLUTE MAXIMUM RATINGS
a
Voltage on Input Relative to Ground . . . . . . . . . . . . . .–0.5V to 7.0V
Voltage on Input Relative to V
SS
. . . . . . . . . . –0.6V to (V
CC
+ 0.5V)
Voltage on DQ
0-7
. . . . . . . . . . . . . . . . . . . . . . –0.5V to (V
CC
+ 0.5V)
Temperature under Bias . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
DC Output Current (1 output at a time, 1s duration) . . . . . . . . 15mA
Note a: Stresses greater than those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at condi-
tions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rat-
ing conditions for extended periods may affect reliability.
DC CHARACTERISTICS
COMMERCIAL
SYMBOL
I
CC1
b
PARAMETER
MIN
Average V
CC
Current
MAX
90
75
65
3
10
27
23
20
1.5
±1
±5
2.2
V
SS
– .5
2.4
0.4
0
70
–40
V
CC
+ .5
0.8
2.2
V
SS
– .5
2.4
0.4
85
MIN
MAX
90
75
65
3
10
28
24
21
1.5
±1
±5
V
CC
+ .5
0.8
mA
mA
mA
mA
mA
mA
mA
mA
mA
μA
μA
V
V
V
V
°C
INDUSTRIAL
UNITS
(V
CC
= 5.0V
±
10%)
NOTES
t
AVAV
= 25ns
t
AVAV
= 35ns
t
AVAV
= 45ns
All Inputs Don’t Care, V
CC
= max
W
≥
(V
CC
– 0.2V)
All Others Cycling, CMOS Levels
t
AVAV
= 25ns, E
≥
V
IH
t
AVAV
= 35ns, E
≥
V
IH
t
AVAV
= 45ns, E
≥
V
IH
E
≥
(V
CC
– 0.2V)
All Others V
IN
≤
0.2V or
≥
(V
CC
– 0.2V)
V
CC
= max
V
IN
= V
SS
to V
CC
V
CC
= max
V
IN
= V
SS
to V
CC
, E or G
≥
V
IH
All Inputs
All Inputs
I
OUT
= – 4mA
I
OUT
= 8mA
I
CC2
c
I
CC3
b
I
SB1
d
Average V
CC
Current during
STORE
Average V
CC
Current at t
AVAV
= 200ns
5V, 25°C, Typical
Average V
CC
Current
(Standby, Cycling TTL Input Levels)
V
CC
Standby Current
(Standby, Stable CMOS Input Levels)
Input Leakage Current
Off-State Output Leakage Current
Input Logic “1” Voltage
Input Logic “0” Voltage
Output Logic “1” Voltage
Output Logic “0” Voltage
Operating Temperature
I
SB2
d
I
ILK
I
OLK
V
IH
V
IL
V
OH
V
OL
T
A
Note b: I
CC1
and I
CC3
are dependent on output loading and cycle rate. The specified values are obtained with outputs unloaded.
Note c: I
CC2
and I
CC4
are the average currents required for the duration of the respective
STORE
cycles (t
STORE
) .
Note d: E
≥
V
IH
will not produce standby current levels until any nonvolatile cycle in progress has timed out.
AC TEST CONDITIONS
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 3V
Input Rise and Fall Times
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤
5ns
Input and Output Timing Reference Levels . . . . . . . . . . . . . . . 1.5V
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Figure 1
5.0V
CAPACITANCE
e
SYMBOL
C
IN
C
OUT
PARAMETER
Input Capacitance
Output Capacitance
(T
A
= 25
°
C, f = 1.0MHz)
MAX
8
7
UNITS
pF
pF
CONDITIONS
480 Ohms
OUTPUT
255 Ohms
ΔV
= 0 to 3V
ΔV
= 0 to 3V
30 pF
INCLUDING
SCOPE AND
FIXTURE
Note e: These parameters are guaranteed but not tested.
Figure 1: AC Output Loading
March 2006
2
Document Control # ML0010 rev 0.2
STK16C68
SRAM READ CYCLES #1 & #2
SYMBOLS
NO.
1
2
3
4
5
6
7
8
9
10
11
PARAMETER
#1, #2
t
ELQV
t
AVAV
f
t
AVQV
g
t
GLQV
t
AXQX
g
t
ELQX
t
EHQZ
h
t
GLQX
t
GHQZ
h
t
ELICCH
e
t
EHICCL
d, e
Alt.
t
ACS
t
RC
t
AA
t
OE
t
OH
t
LZ
t
HZ
t
OLZ
t
OHZ
t
PA
t
PS
Chip Enable Access Time
Read Cycle Time
Address Access Time
Output Enable to Data Valid
Output Hold after Address Change
Chip Enable to Output Active
Chip Disable to Output Inactive
Output Enable to Output Active
Output Disable to Output Inactive
Chip Enable to Power Active
Chip Disable to Power Standby
0
25
0
10
0
35
5
5
10
0
13
0
45
25
25
10
5
5
13
0
15
MIN
MAX
25
35
35
15
5
5
15
MIN
MAX
35
45
45
20
MIN
MAX
45
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
STK16C68-25
(V
CC
= 5.0V
±
10%)
STK16C68-35
STK16C68-45
UNITS
Note f: W must be high during SRAM READ cycles and low during SRAM WRITE cycles.
Note g: I/O state assumes E, G < V
IL
and W > V
IH
; device is continuously selected.
Note h: Measured + 200mV from steady state output voltage.
SRAM READ CYCLE #1:
Address Controlled
f, g
t
AVAV
ADDRESS
5
3
2
t
AVQV
DATA VALID
t
AXQX
DQ (DATA OUT)
SRAM READ CYCLE #2:
E Controlled
f
t
AVAV
ADDRESS
t
ELQV
E
t
ELQX
t
EHQZ
7
6
1
2
t
EHICCL
11
G
4
t
GLQV
t
GHQZ
9
t
GLQX
DQ (DATA OUT)
t
ELICCH
I
CC
STANDBY
10
DATA VALID
8
ACTIVE
March 2006
3
Document Control # ML0010 rev 0.2
STK16C68
SRAM WRITE CYCLES #1 & #2
SYMBOLS
NO.
#1
12
13
14
15
16
17
18
19
20
21
t
AVAV
t
WLWH
t
ELWH
t
DVWH
t
WHDX
t
AVWH
t
AVWL
t
WHAX
t
WLQZ
h, i
t
WHQX
#2
t
AVAV
t
WLEH
t
ELEH
t
DVEH
t
EHDX
t
AVEH
t
AVEL
t
EHAX
Alt.
t
WC
t
WP
t
CW
t
DW
t
DH
t
AW
t
AS
t
WR
t
WZ
t
OW
Write Cycle Time
Write Pulse Width
Chip Enable to End of Write
Data Set-up to End of Write
Data Hold after End of Write
Address Set-up to End of Write
Address Set-up to Start of Write
Address Hold after End of Write
Write Enable to Output Disable
Output Active after End of Write
5
PARAMETER
MIN
25
20
20
10
0
20
0
0
10
5
MAX
MIN
35
25
25
12
0
25
0
0
13
5
MAX
MIN
45
30
30
15
0
30
0
0
15
MAX
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
STK16C68-25
(V
CC
= 5.0V
±
10%)
STK16C68-35
STK16C68-45
UNITS
Note i:
Note j:
If W is low when E goes low, the outputs remain in the high-impedance state.
E or W must be
≥
V
IH
during address transitions.
SRAM WRITE CYCLE #1:
W Controlled
j
t
AVAV
ADDRESS
t
ELWH
E
14
19
12
t
WHAX
t
AVWH
t
AVWL
W
t
WLWH
15
16
13
18
17
t
DVWH
DATA IN
t
WLQZ
DATA OUT
PREVIOUS DATA
HIGH IMPEDANCE
20
DATA VALID
t
WHDX
t
WHQX
21
SRAM WRITE CYCLE #2:
E Controlled
j
t
AVAV
ADDRESS
t
AVEL
E
18
14
19
12
t
ELEH
t
EHAX
t
AVEH
t
WLEH
W
t
DVEH
DATA IN
DATA OUT
HIGH IMPEDANCE
DATA VALID
15
16
13
17
t
EHDX
March 2006
4
Document Control # ML0010 rev 0.2
STK16C68
AutoStorePlus™/POWER-UP RECALL
SYMBOLS
NO.
Standard
22
23
24
25
t
RESTORE
t
stg
V
SWITCH
V
RESET
Power-up
RECALL
Duration
Maximum V
CC
Slew Time to Ground
Low Voltage Trigger Level
Low Voltage Reset Level
500
4.0
4.5
3.6
PARAMETER
MIN
MAX
550
μs
ns
V
V
e
k
f, h
(V
CC
= 5.0V
±
10%)
STK16C68
UNITS
NOTES
Note k: t
RESTORE
starts from the time V
CC
rises above V
SWITCH
.
AutoStorePlus™/POWER-UP RECALL
V
CC
5V
24
V
SWITCH
25
V
RESET
23
t
stg
AutoStore™
POWER-UP
RECALL
22
t
RESTORE
W
DQ (DATA OUT)
POWER-UP
RECALL
BROWN OUT
NO
STORE
DUE TO
NO SRAM WRITES
NO
RECALL
(V
CC
DID NOT GO
BELOW V
RESET
)
BROWN OUT
AutoStorePlus™
NO
RECALL
(V
CC
DID NOT GO
BELOW V
RESET
)
BROWN OUT
AutoStorePlus™
RECALL
WHEN
V
CC
RETURNS
ABOVE V
SWITCH
March 2006
5
Document Control # ML0010 rev 0.2
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