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M5M417400CJ-6S

Description
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
Categorystorage    storage   
File Size472KB,22 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric View All

M5M417400CJ-6S Overview

FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM

M5M417400CJ-6S Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeSOJ
package instructionSOJ, SOJ24/26,.34
Contacts24
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEELF REFRESH
I/O typeCOMMON
JESD-30 codeR-PDSO-J24
JESD-609 codee0
length17.14 mm
memory density16777216 bi
Memory IC TypeFAST PAGE DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals24
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ24/26,.34
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height3.55 mm
self refreshYES
Maximum standby current0.0005 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

M5M417400CJ-6S Preview

MITSUBISHI LSIs
M5M417400CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
DESCRIPTION
This is a family of 4194304-word by 4-bit dynamic RAMS,
fabricated with the high performance CMOS process, and is ideal
for large-capacity memory systems where high speed, low power
dissipation, and low costs are essential.
The use of double-layer metal process combined with twin-well
CMOS technology and a single-transistor dynamic storage stacked
capacitor cell provide high circuit density at reduced costs.
Multiplexed address inputs permit both a reduction in pins and an
increase in system densities.
PIN DESCRIPTION
Pin name
A
0
~ A
11
DQ
1
~ DQ
4
RAS
CAS
W
OE
V
CC
V
SS
Function
Address inputs
Data inputs / outputs
Row address strobe input
Column address strobe input
Write control input
Output enable input
Power supply (+5V)
Ground (0V)
PIN CONFIGURATION (TOP VIEW)
FEATURES
RAS
CAS
access
time
(max.ns)
Address
access
time
(max.ns)
OE
access
time
(max.ns)
Cycle
time
(min.ns)
Power
dissipa-
tion
(typ.mW)
Type Name
access
time
(max.ns)
M5M417400CXX-5,-5S
M5M417400CXX-6,-6S
M5M417400CXX-7,-7S
50
60
70
13
15
20
25
30
35
13
15
20
90
110
130
655
540
475
XX=J, TP
• Standard 26 pin SOJ, 26 pin TSOP
• Single 5V
±
10% supply
• Low stand-by power dissipation
5.5mW(Max) ..................................CMOS Input level
2.2mW (Max)* ...............................CMOS Input level
• Low operating power dissipation
M5M417400Cxx-5,-5S .................... 800.0mW (Max)
M5M417400Cxx-6,-6S .................... 660.0mW (Max)
M5M417400Cxx-7,-7S .................... 580.0mW (Max)
Self refresh capability *
self refresh current ................................ 200.0
µ
A(Max)
Outline 26P0D-B (300mil SOJ)
• Fast-page mode, Read-modify-write, RAS-only refresh
• CAS before RAS refresh, Hidden refresh capabilities
Early-write mode and OE to control output buffer impedance
• All inputs, output TTL compatible and low capacitance
• 2048 refresh cycles every 32ms (A
0
~ A
10
)
*Applicable to self refresh version (M5M417400CJ,TP-5S,-6S,
-7S :option) only
APPLICATION
Main memory unit for computers, Microcomputer memory, Refresh
memory for CRT
Outline 26P3D-E (300mil TSOP)
NC: NO CONNECTION
1
MITSUBISHI LSIs
M5M417400CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
FUNCTION
The M5M417400CJ,TP provide, in addition to normal read, write, and read-modify-write operations, a number of other functions, e.g., fast
page mode, RAS-only refresh, and delayed-write. The input conditions for each are shown in Table 1.
Table 1 Input conditions for each mode
Inputs
Operation
Read
Write (Early write)
Write (Delayed write)
Read-modify-write
RAS-only refresh
Hidden refresh
Self refresh
CAS before RAS refresh
Stand-by
RAS
ACT
ACT
ACT
ACT
ACT
ACT
ACT
ACT
NAC
CAS
ACT
ACT
ACT
ACT
NAC
ACT
ACT
ACT
DNC
W
NAC
ACT
ACT
ACT
DNC
NAC
NAC
NAC
DNC
OE
ACT
DNC
DNC
ACT
DNC
ACT
DNC
DNC
DNC
Row
address
APD
APD
APD
APD
APD
APD
DNC
DNC
DNC
Column
address
APD
APD
APD
APD
DNC
DNC
DNC
DNC
DNC
Input/Output
Input
OPN
VLD
VLD
VLD
DNC
OPN
DNC
DNC
DNC
Output
VLD
OPN
IVD
VLD
OPN
VLD
OPN
OPN
OPN
Refresh
YES
YES
YES
YES
YES
YES
YES
YES
NO
Remark
Fast
page
mode
identical
Note: ACT: active, NAC: nonactive, DNC: don’t care, VLD: valid, IVD: invalid, APD: applied, OPN: open
BLOCK DIAGRAM
2
MITSUBISHI LSIs
M5M417400CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
O
P
d
T
opr
T
stg
Supply voltage
Input voltage
Output voltage
Output current
Power dissipation
Operating temperature
Storage temperature
Ta = 25°C
With respect to V
SS
Parameter
Conditions
Ratings
-1 ~ 7
-1 ~ 7
-1 ~ 7
50
1000
0 ~ 70
-65 ~ 150
Unit
V
V
V
mA
mW
°C
°C
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 ~ 70°C, unless otherwise noted) (Note 1)
Symbol
V
CC
V
SS
V
IH
V
IL
Note 1:
Supply voltage
Supply voltage
High-level input voltage, all inputs
Low-level input voltage, all inputs
All voltage values are with respect to V
SS
.
Parameter
Limits
Min
4.5
0
2.4
-1.0**
Nom
5
0
Max
5.5
0
5.5
0.8
Unit
V
V
V
V
**: V
IL(min.)
is -2.0V when undershoot width is less than 25ns. (Undershoot width is with respect to V
SS
.)
ELECTRICAL CHARACTERISTICS
(Ta = 0 ~ 70°C, V
CC
= 5V ± 10%, V
SS
= 0V, unless otherwise noted) (Note 2)
Symbol
V
OH
V
OL
l
OZ
I
I
I
CC1(AV)
High-level output voltage
Low-level output voltage
Off-state output current
Input current
Average supply current
from V
CC
, operating
(Note 3,4)
I
CC2
Supply current from V
CC
, stand-by
Average supply current
I
CC3 (AV)
from V
CC
, refreshing
(Note 3)
Average supply current
I
CC4 (AV)
from V
CC
, Fast-Page-Mode
(Note 3,4)
Average supply current from V
CC
,
I
CC6 (AV)
CAS before RAS refresh mode
(Note 3)
Note 2:
3:
4:
M5M417400C-5,-5S
M5M417400C-6,-6S
M5M417400C-7,-7S
(Note 5)
M5M417400C-5,-5S
M5M417400C-6,-6S
M5M417400C-7,-7S
M5M417400C-5,-5S
M5M417400C-6,-6S
M5M417400C-7,-7S
M5M417400C-5,-5S
M5M417400C-6,-6S
M5M417400C-7,-7S
Parameter
I
OH
= -5.0mA
I
OL
= 4.2mA
Q floating 0V
V
OUT
5.5V
0V
V
IN
≤5.5V,
Other inputs pins = 0V
RAS, CAS cycling
t
RC
= t
WC
= min.
output open
RAS = CAS = V
IH
, output open
RAS = CAS
V
CC
-0.2V
RAS cycling, CAS = V
IH
t
RC
= min.
output open
RAS = V
IL
, CAS cycling
t
PC
= min.
output open
CAS before RAS refresh cycling
t
RC
= min.
output open
Test conditions
Limits
Min
2.4
0
-10
-10
Typ
Max
V
CC
0.4
10
10
145
120
105
2
0.5
145
120
105
80
70
60
145
120
105
mA
mA
mA
mA
mA
Unit
V
V
µA
µA
Current flowing into an IC is positive, out is negative.
I
CC1
(AV), I
CC3
(AV), I
CC4
(AV) and I
CC6
(AV) are dependent on cycle rate. Maximum current is measured at the fastest cycle rate.
I
CC1
(AV) and I
CC4
(AV) are dependent on output loading. Specified values are obtained with the output open.
3
MITSUBISHI LSIs
M5M417400CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
CAPACITANCE
(Ta = 0 ~ 70°C, V
CC
= 5V ± 10%, V
SS
= 0V, unless otherwise noted)
Symbol
C
I(A)
C
I(OE)
C
I(W)
C
I(RAS)
C
I(CAS)
C
I/O
Parameter
Input capacitance, address inputs
Input capacitance, OE input
Input capacitance, write control input
Input capacitance, RAS input
Input capacitance, CAS input
Input/Output capacitance, data ports
V
I
= V
SS
f = 1MHz
V
I
= 25mVrms
Test conditions
Limits
Min
Typ
Max
5
7
7
7
7
8
Unit
pF
pF
pF
pF
pF
pF
SWITCHING CHARACTERISTICS
(Ta = 0 ~ 70°C, V
CC
= 5V ± 10%, V
SS
= 0V, unless otherwise noted, see notes 5, 12, 13)
Limits
Symbol
Parameter
M5M417400C-5,-5S
Min
t
CAC
t
RAC
t
AA
t
CPA
t
OEA
t
CLZ
t
OFF
t
OEZ
Note 5:
Access time from CAS
Access time from RAS
Column address access time
Access time from CAS precharge
Access time from OE
Output low impedance time from CAS low
Output disable time after CAS high
Output disable time after OE high
(Note 6, 7)
(Note 6, 8)
(Note 6, 9)
(Note 6, 10)
(Note 6)
(Note 6)
(Note 11)
(Note 11)
5
0
0
13
13
Max
13
50
25
30
13
5
0
0
15
15
M5M417400C-6,-6S
Min
Max
15
60
30
35
15
5
0
0
15
15
M5M417400C-7,-7S
Min
Max
20
70
35
40
20
ns
ns
ns
ns
ns
ns
ns
ns
Unit
An initial pause of 500
µ
s is required after power-up followed by a minimum of eight initialization RAS cycles. The initialization cycles should be done either by RAS-only
refresh cycles or by CAS before RAS refresh cycles only.
Note the RAS may be cycled during the initial pause. And any 8 RAS or RAS/CAS cycles are required after prolonged periods (greater than 32ms) of RAS inactivity before
proper device operation is achieved.
After the initialization cycles, RAS should be kept either higher than V
IH(min)
or lower than V
IL(max)
except RAS transition time.
Measured with a load circuit equivalent to 2 TTL loads and 100pF.
Assumes that t
RCD
t
RCD(max)
and t
ASC
t
ASC(max)
.
Assumes that t
RCD
t
RCD(max)
and t
RAD
t
RAD(max)
. If t
RCD
or t
RAD
is greater than the maximum recommended value shown in this table, t
RAC
will increase by amount that
t
RCD
exceeds the value shown.
Assumes that t
RAD
t
RAD(max)
and t
ASC
t
ASC(max)
.
Assumes that t
CP
t
CP(max)
and t
ASC
t
ASC(max)
.
t
OFF(max)
and t
OEZ(max)
defines the time at which the output achieves the high impedance state (I
OUT
| ± 10
µA
|) and is not reference to V
OH(min)
or V
OL(max)
.
6:
7:
8:
9:
10:
11:
4
MITSUBISHI LSIs
M5M417400CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 16777216-BIT (4194304-WORD BY 4-BIT) DYNAMIC RAM
TIMING REQUIREMENTS (For Read, Write, Read-Modify-Write, Refresh, and Fast-Page Mode Cycles)
(Ta = 0 ~ 70°C, V
CC
= 5V ± 10%, V
SS
= 0V, unless otherwise noted. See notes 12, 13)
Limits
Symbol
Parameter
M5M417400C-5,-5S
Min
t
REF
t
RP
t
RCD
t
CRP
t
RPC
t
CPN
t
RAD
t
ASR
t
ASC
t
RAH
t
CAH
t
DZC
t
DZO
t
CDD
t
ODD
t
T
13:
14:
15:
16:
17:
18:
19:
Refresh cycle time
RAS high pulse width
Delay time, RAS low to CAS low
Delay time, CAS high to RAS low
Delay time, RAS high to CAS low
CAS high pulse width
Column address delay time from RAS low
Row address setup time before RAS low
Column address setup time before CAS low
Row address hold time after RAS low
Column address hold time after CAS low
Delay time, data to CAS low
Delay time, data to OE low
Delay time, CAS high to data
Delay time, OE high to data
Transition time
(Note 17)
(Note 17)
(Note 18)
(Note 18)
(Note 19)
(Note 16)
(Note 15)
(Note 14)
30
18
10
0
10
13
0
0
8
13
0
0
13
13
1
50
10
25
37
Max
32
40
20
10
0
10
15
0
0
10
15
0
0
15
15
1
50
10
30
45
M5M417400C-6,-6S
Min
Max
32
50
20
10
0
10
15
0
0
10
15
0
0
15
15
1
50
10
35
50
M5M417400C-7,-7S
Min
Max
32
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Unit
Note 12: The timing requirements are assumed t
T
= 5ns.
V
IH(min)
and V
IL(max)
are reference levels for measuring timing of input signals.
t
RCD(max)
is specified as a reference point only. If t
RCD
is less than t
RCD(max)
, access time is t
RAC
. If t
RCD
is greater than t
RCD(max)
, access time is controlled exclusively by
t
CAC
or t
AA
. t
RCD(min)
is specified as t
RCD(min)
= t
RAH(min)
+ 2t
H
+ t
ASC(min)
.
t
RAD(max)
is specified as a reference point only. If t
RAD
t
RAD(max)
and t
ASC
t
ASC(max)
, access time is controlled exclusively by t
AA
.
t
ASC(max)
is specified as a reference point only. If t
RCD
t
RCD(max)
and t
ASC
t
ASC(max)
, access time is controlled exclusively by t
CAC
.
Either t
DZC
or t
DZO
must be satisfied.
Either t
CDD
or t
ODD
must be satisfied.
t
T
is measured between V
IH(min)
and V
IL(max)
.
Read and Refresh Cycles
Limits
Symbol
Parameter
M5M417400C-5,-5S
Min
t
RC
t
RAS
t
CAS
t
CSH
t
RSH
t
RCS
t
RCH
t
RRH
t
RAL
t
OCH
t
ORH
Read cycle time
RAS low pulse width
CAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read setup time after CAS high
Read hold time after CAS low
Read hold time after RAS low
Column address to RAS hold time
CAS hold time after OE low
RAS hold time after OE low
(Note 20)
(Note 20)
90
50
13
50
13
0
0
10
25
13
13
10000
10000
Max
M5M417400C-6,-6S
Min
110
60
15
60
15
0
0
10
30
15
15
10000
10000
Max
M5M417400C-7,-7S
Min
130
70
20
70
20
0
0
10
35
20
20
10000
10000
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Unit
Note 20: Either t
RCH
or t
RRH
must be satisfied for a read cycle.
5

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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