EEWORLDEEWORLDEEWORLD

Part Number

Search

SQW-138-01-SM-D-VS-A

Description
Board Connector
CategoryThe connector    The connector   
File Size250KB,3 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

SQW-138-01-SM-D-VS-A Overview

Board Connector

SQW-138-01-SM-D-VS-A Parametric

Parameter NameAttribute value
Reach Compliance Codecompliant
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Manufacturer's serial numberSQW-1
Base Number Matches1
REVISION AI
NOTES:
SQW-1XX-01-XXX-D-VS-XX-XXX
OPTION
-A: STAKED & MOLDED IN ALIGNMENT PIN
(5 POS MIN) (USE SM-A8H, SEE FIG 3, SHT 2)
-LC: LOCKING CLIP (5 POS MIN)
(USE LC-07-TM, SEE FIG 4, SHT 2 & NOTE 8)
-P: PICK & PLACE PAD (4 POS MIN)
(USE LMP-03, SEE FIG 6, SHT 2)
-TR: TAPE & REEL
(AVAILABLE POS 4 THRU 28)
-K: POLYAMIDE FILM PAD (4 POS MIN)
(USE K-500-300, SEE FIG 7, SHT 2)
(.005 [.13] THICKNESS WITH SILICONE ADHESIVE)
TAIL STYLE
-VS: VERTICAL
ROW SPECIFICATION
-D: DOUBLE (USE SQW-XX-D)
POLARIZATION OPTION
-XXX: INDICATES POSITION POLARIZED
(USE PK-07-N, SEE FIG 2, SHT 2)
DO NOT
SCALE FROM
THIS PRINT
No OF POSITIONS
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. POSITIONS -04 THRU -50 ARE TO BE TUBED.
-02 THRU -50
(PER ROW)
3. POSITIONS 02 & 03 ARE TO BE LAYERED PACKAGED.
4. MAXIMUM CUT FLASH: .010[.25].
LEAD STYLE
5. STAKED ALIGNMENT PIN USED AT SAMTECS DISCRETION.
-01
6. MEASURE THE HEIGHT FROM THE EDGE, NOT THE BREAK OFF.
PLATING SPECIFICATION
7. MEASURED AT BEND RADIUS, NOT END OF PIN.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA
8. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED,
MATTE TIN ON TAIL
THE -LC OPTION IS NOT COMPATIBLE WITH AUTO PLACEMENT.
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA
SAMTEC RECOMMENDS MANUAL PLACEMENT FOR ALL
MATTE TIN ON TAIL
ASSEMBLIES WITH THE -LC OPTION.
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
9. MINIMUM PUSHOUT FORCE: .5 LB.
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA
10. COPLANARITY MEASURED AT .0016[0.041] IN/IN
TIN/LEAD (93/7+/-5%) TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA
3µ" ON TAIL
-FM: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-LM: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
C
((No OF POS x .07874 [2.000]) + .0117 [.297]) .010 [.25]
(No OF POS x .07874 [2.000]) - .07874 [2.000] REF
02
.07874 2.0000
REF
.157 4.00
REF
C
.090 2.29
2 MAX SWAY
(EITHER DIRECTION)
01
IN-PROCESS
SQW-XX-D
.059 1.50
REF
.203 5.16
REF
.250 6.35
REF
.0500 1.270
(SEE NOTE 7)
.015 0.38
REF
2 MAX SWAY
(EITHER DIRECTION)
90°
- 0°
+4°
C
SEE NOTE 10
C-97-01-XXX
.0197 0.500 REF (TYP)
SQW-110-01-XXX-D-VS
SHOWN
FIG 1
.034 0.87 REF
.187 4.75 REF
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.015 0.37 REF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 4:1
INSULATOR: LCP, UL 94 VO, COLOR: BLACK
TERMINAL: PHOSPHOR BRONZE
2MM SOCKETS TRIP ASSEMBLY
SQW-1XX-01-XXX-D-VS-XX-XXX
04/22/1997
SHEET
1
OF
3
F:\DWG\MISC\MKTG\SQW-1XX-01-XXX-D-VS-XX-XXX-MKT.SLDDRW
BY:
DEAN P
How to solve the problem of software freezing when running FPGA-related projects
This project uses FPGA to complete the design of a medical Doppler transcranial tester. When testing after the project was completed, it was found that the software occasionally freezes when starting ...
liuwy Embedded System
LCD Data
Collected LCD data...
lovedarling MCU
What type of chip does SH366002 replace?
Zhongying Electronics' lithium battery management chip SH366002 has been widely used in domestic mobile phones. It replaces the chip of Texas Instruments. Does anyone know the model of this chip of Te...
sjmjhf Domestic Chip Exchange
I want to write a touch screen calibration for WinCE, but there is no tchddi.h file
是基于ARM上的WINCE写的 想调用Windows API去写不想用WinCE自带的校准程序基本步骤查得:[code] The following steps detail the basic algorithm for using the touch screen:Call TouchPanelEnable to start the screen sampling.Call TouchPane...
sweetpea Embedded System
Does anyone know the difference between the infrared receiver HS0038 and vs1838B?
I connected a 51 infrared receiver circuit, using the vs1838B iron case. After connecting the circuit according to the instructions, the test was unsuccessful. What is the difference between HS0038 an...
马铃薯疯子 51mcu
Talk about my understanding of walkie-talkie circuit
Simple circuit diagram 1. When the antenna receives the signal, since the signal is very weak, it needs to be amplified, which requires LNA (low noise amplifier). Then it passes through a bandpass fil...
护花使者 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1597  598  2007  2635  477  33  13  41  54  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号