EB52F5G15AN-16.000M
EB52F5 G 15 A N -16.000M
Series
3.3Vdc 14-Pin DIP LVCMOS TCXO
Initial Tolerance
±1.0ppm Maximum
Frequency Stability
±1.5ppm Maximum
Nominal Frequency
16.000MHz
Control Voltage
None (No Connect on Pin 1)
Operating Temperature Range
0°C to +50°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Initial Tolerance
Frequency Stability
Frequency Stability vs. Input Voltage
Frequency Stability vs. Aging
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
Internal Trim
Input Impedance
Phase Noise
Storage Temperature Range
16.000MHz
±1.0ppm Maximum (Measured at Nominal Vdd and Vc)
±1.5ppm Maximum
±0.3ppm Maximum (Vdd ±5%)
±1ppm/Year Maximum (at 25°C)
±0.2ppm Maximum (±10%)
0°C to +50°C
3.3Vdc ±5%
15mA Maximum (Measured at Steady State at 25°C)
90% of Vdd Minimum
10% of Vdd Maximum
6nSec Maximum (Measured at 20% to 80% of waveform)
50% ±5% (Measured at 50% of waveform)
15pF Maximum
CMOS
None (No Connect on Pin 1)
±3ppm Minimum (at 25°C, Top Access)
10kOhms Typical
-70dBc/Hz at 10Hz Offset, -100dBc/Hz at 100Hz Offset, -130dBc/Hz at 1kHz Offset, -140dBc/Hz at 10kHz
Offset, -145dBc/Hz at 100kHz Offset (Typical Values at 19.440MHz)
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
EB52F5G15AN-16.000M
Test Circuit for No Connect Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No
Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
EB52F5G15AN-16.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
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