M25P32-VMW6P datasheet, PDF - EEWORLD Datasheet

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M25P32-VMW6P: Description4MX8 FLASH 2.7V PROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8; Categorystorage storage; File Size466KB，53 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M25P32-VMW6P Overview

4MX8 FLASH 2.7V PROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

M25P32-VMW6P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum clock frequency (fCLK)	20 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	5.62 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	2.5 mm
Serial bus type	SPI
Maximum standby current	0.00001 A
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	5.62 mm
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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M25P32

32-Mbit, low voltage, serial Flash memory

with 75 MHz SPI bus interface

Features

■

32 Mbit of Flash memory

2.7 V to 3.6 V single supply voltage

SPI bus compatible serial interface

75 MHz clock rate (maximum)

= 9 V for Fast Program/Erase mode

(optional)

Page Program (up to 256 bytes)

– in 0.64 ms (typical)

Sector Erase (512 Kbit) in 0.6 s (typical)

Bulk Erase:

– in 23 s (typical)

– in 17 s (typical with V

= 9 V)

Deep Power-down mode 1 µA (typical)

Electronic Signatures

– JEDEC standard two-byte signature

(2016h)

– Unique ID code (UID) +16 bytes of CFI

data

– RES instruction, one-byte, signature (15h),

for backward compatibility

Hardware Write Protection of the memory area

selected using the BP0, BP1 and BP2 bits

More than 100 000 Erase/Program cycles per

sector

More than 20 year data retention

Packages

– ECOPACK® (RoHS compliant)

SO8W (MW)

208 mils

VDFPN8 (ME)

8 × 6 mm (MLP8)

■

VFQFPN8 (MP)

6 × 5 mm

SO16 (MF)

300 mils width

■

June 2007

Rev 10

1/53

www.st.com

Contents

M25P32

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Serial data output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial data input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Write Protect/Enhanced Program supply voltage (W/V

) . . . . . . . . . . . . 10

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Polling during a Write, Program or Erase cycle . . . . . . . . . . . . . . . . . . . . 13

Fast Program/Erase mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Active Power, Standby Power and Deep Power-down modes . . . . . . . . . 13

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.1

6.2

6.3

6.4

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.4.1

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2/53

List of tables

M25P32

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Protected area sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read Identification (RDID) data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Power-up timing and VWI threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

AC characteristics (T9HX technology) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

VDFPN8 (MLP8) 8-lead Very thin Dual Flat Package No lead, 8 × 6 mm,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

SO16 wide – 16-lead Plastic Small Outline, 300 mils body width, mechanical data. . . . . . 47

VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat Package No lead,

6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

SO8W 8 lead Plastic Small Outline, 208 mils body width, package

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

4/53

M25P32

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

Figure 28.

Figure 29.

Figure 30.

Figure 31.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

VDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

SO connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus Master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Enable (WREN) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 23

Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 25

Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 28

Read Data Bytes at Higher Speed (FAST_READ) instruction sequence

and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Sector Erase (SE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Bulk Erase (BE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Deep Power-down (DP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Release from Deep Power-down and Read Electronic Signature (RES)

instruction sequence and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Release from Deep Power-down (RES) instruction sequence . . . . . . . . . . . . . . . . . . . . . . 36

Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Write Protect Setup and Hold timing during WRSR when SRWD=1 . . . . . . . . . . . . . . . . . 44

Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

PPH

timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

VDFPN8 (MLP8) 8-lead Very thin Dual Flat Package No lead, 8 × 6 mm,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

SO16 wide – 16-lead Plastic Small Outline, 300 mils body width, package outline . . . . . . 47

VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat Package No lead,

6 × 5 mm, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

SO8W 8 lead Plastic Small Outline, 208 mils body width, package outline . . . . . . . . . . . . 49

5/53

M25P32-VMW6P Related Products

	M25P32-VMW6P	M25P32-VMP6TP	M25P32-VMP6P	M25P32-VMW6TP
Description	4MX8 FLASH 2.7V PROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	4M X 8 FLASH 2.7V PROM, PDSO8, ROHS COMPLIANT, MLP-8	4M X 8 FLASH 2.7V PROM, PDSO8, ROHS COMPLIANT, MLP-8	4MX8 FLASH 2.7V PROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	SOIC	SOIC	SOIC
package instruction	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	SON, SOLCC8,.25	SON, SOLCC8,.25	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Contacts	8	8	8	8
Reach Compliance Code	compliant	unknown	unknown	compliant
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum clock frequency (fCLK)	20 MHz	50 MHz	50 MHz	20 MHz
Data retention time - minimum	20	20	20	20
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	R-PDSO-G8
length	5.62 mm	6 mm	6 mm	5.62 mm
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	4MX8	4MX8	4MX8	4MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SON	SON	SOP
Encapsulate equivalent code	SOP8,.3	SOLCC8,.25	SOLCC8,.25	SOP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	260
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.5 mm	1 mm	1 mm	2.5 mm
Serial bus type	SPI	SPI	SPI	SPI
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Maximum slew rate	0.015 mA	0.015 mA	0.015 mA	0.015 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	NO LEAD	NO LEAD	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	NOT SPECIFIED	40
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	5.62 mm	5 mm	5 mm	5.62 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Base Number Matches	1	1	1	-

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