REVISIONS
LTR
D
E
F
DESCRIPTION
Updated boilerplate. Added device types 13-16. glg
Revision in accordance with NOR 5962-R069-99. glg
Add devices 17 – 20. This revision addresses programming
interchangeability issue as a result of revision E, NOR 5962-R069-
99. Figure 2, Truth table; will be modified to add a second truth table
for devices 17 – 20. This change indicates devices which require V
PP
to be tied to V
CC
, from those devices which may be tied to either V
IL
or
V
IH
as was previously the requirement prior to revision E. ksr
Update to paragraphs, part of regular review cycle. ksr
DATE (YR-MO-DA)
95 – 12 – 15
99 – 08 – 04
APPROVED
Michael Frye
Raymond Monnin
03 – 02 – 05
Raymond Monnin
G
09-02-18
Robert M. Heber
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
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15
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16
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17
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18
REV
SHEET
PREPARED BY
James E. Jamison
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19
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1
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2
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3
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14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Raymond Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
95 – 12 – 15
REVISION LEVEL
G
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 128K X 8-BIT
UVEPROM, MONOLITHIC
SILICON
SIZE
A
SHEET
1 OF
19
5962-E180-09
CAGE CODE
67268
5962-89614
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
|
|
|
Federal
stock class
designator
\
-
|
|
|
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03,17
04,18
05,10,19
06,11,20
07,12
08,13
09,14
15
16
Generic number 1/
Circuit function
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
(128K x 8) UVEPROM
Access time
300 ns
250 ns
200 ns
170 ns
150 ns
120 ns
90 ns
70 ns
55 ns
45 ns
35 ns
89614
01
|
|
|
Device
type
(see 1.2.2)
/
M
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
Case
outline
(see 1.2.4)
A
|
|
|
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
_______________
1/
2/
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in QML-38535 and MIL-HDBK-103.
Lid shall be transparent to permit ultraviolet light erasure.
Descriptive designator
GDIP1-T32 or CDIP2-T32
CQCC1-N32
CQCC2-N32
Terminals
32
32
32
Package style 2/
Dual-in-line
Rectangular leadless chip carrier
Rectangular leadless chip carrier
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89614
SHEET
G
2
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 3/
Storage temperature --------------------------------------------------------------
All input or output voltage with respect to ground ------------------------
Voltage on A9 with respect to ground ----------------------------------------
V
PP
supply voltage with respect to ground
during programming (device types 01-12,17-20) ------------------------
(device types 13-16) -------------------------------------------------------------
V
CC
supply voltage with respect to ground (device types 01-12,17-20)
(device types 13-16) -------------------------------------------------------------
Power dissipation (P
D
) ------------------------------------------------------------
Lead temperature (soldering, 10 seconds) ----------------------------------
Thermal resistance, junction-to-case (Θ
JC
):
Case X, Y and Z -----------------------------------------------------------------
Junction temperature (T
J
) -------------------------------------------------------
Endurance ---------------------------------------------------------------------------
Data retention -----------------------------------------------------------------------
1.4 Recommended operating conditions.
Case operating temperature range (T
C
) --------------------------------------
Supply voltage range (V
CC
) ------------------------------------------------------
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
-55C to +125C
4.5 V dc to 5.5 V dc
-65C to +150C
-0.6 V dc to V
CC
+0.5 V dc
-0.6 V dc to +13.0 V dc
-0.6 V dc to +13.5 V dc
-0.5 V dc to +13.0 V dc
-0.6 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
330 mW 4/
+300C
See MIL-STD-1835
+150C 5/
50 cycles/byte, minimum
10 years, minimum
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-00
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
_________________
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ Must withstand the added P
D
due to short circuit test; e.g., I
OS
.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89614
SHEET
G
3
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2 herein. When required, in screening (see 4.2 herein), or quality conformance inspection
groups A, B, C, or D (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test in a checkerboard or
similar pattern (a minimum of 50 percent of the total number of bits programmed).
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this document.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Processing EPROM's. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
3.5.1 Erasure of EPROM's. When specified, devices shall be erased in accordance with the procedure and characteristics
specified in 4.5 herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89614
SHEET
G
4
3.5.2 Programmability of EPROM's. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.6 herein.
3.5.3 Verification of erasure of programmability of EPROM's. When specified, devices shall be verified as either
programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test
(subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a
device failure, and shall be removed from the lot.
3.6 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.9 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.10 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.12 Substitution. Substitution data shall be as indicated in appendix A herein.
3.13 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with
test data.
3.14 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test
shall be done for initial characterization and after any design or process change which may affect data retention. The methods
and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein, over the full
military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon
request by the preparing or acquiring activity, along with the test data.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89614
SHEET
G
5
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