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LSIFC919

Description
Micro Peripheral IC, PBGA329,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,146 Pages
ManufacturerBroadcom
Download Datasheet Parametric Compare View All

LSIFC919 Overview

Micro Peripheral IC, PBGA329,

LSIFC919 Parametric

Parameter NameAttribute value
package instructionBGA, BGA329,23X23,50
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B329
Number of terminals329
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA329,23X23,50
Package shapeSQUARE
Package formGRID ARRAY
power supply2.5,3.3 V
Certification statusNot Qualified
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Base Number Matches1
TECHNICAL
MANUAL
LSIFC919
Single Channel
Fibre Channel
I/O Processor
Revision 2.1
October 2002
®
DB14-000151-02

LSIFC919 Related Products

LSIFC919
Description Micro Peripheral IC, PBGA329,
package instruction BGA, BGA329,23X23,50
Reach Compliance Code compliant
JESD-30 code S-PBGA-B329
Number of terminals 329
Maximum operating temperature 70 °C
Package body material PLASTIC/EPOXY
encapsulated code BGA
Encapsulate equivalent code BGA329,23X23,50
Package shape SQUARE
Package form GRID ARRAY
power supply 2.5,3.3 V
Certification status Not Qualified
surface mount YES
Temperature level COMMERCIAL
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
Base Number Matches 1

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